Work

Modeling of cure-induced warpage of plastic IC packages

Year: 2004

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/esime.2004.1304019

Authors: D.G. Yang, K.M.B. Jansen, L.J. Ernst, G.Q. Zhang, W.D. van Driel, H.J.L. Bressers

Institutions: Delft University of Technology, Philips (Netherlands)

Language: English

Topic: Epoxy Resin Curing Processes

Subfield: Polymers and Plastics

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2145264648

FWCI: 68.71

Cites: 9

Cited by: 45

Related to: 10