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Pruek Vanna-Iampikul

Observed names: Pruek Vanna-iampikul, Vanna-iampikul, Pruek
Institution: Burapha University
ORCID: 0000-0002-2897-7142
Observed ORCID: 0000-0002-2897-7142
OpenAlex ID: A5073660004
Snap-3D: A Constrained Placement-Driven Physical Design Methodology for Face-to-Face-Bonded 3D ICs
2021 · Pruek Vanna-Iampikul, Chengjia Shao, et al. · International Symposium on Physical Design · 24
FastTuner: Transferable Physical Design Parameter Optimization using Fast Reinforcement Learning
2024 · Hao-Hsiang Hsiao, Yi-Chen Lu, et al. · International Symposium on Physical Design · 19
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Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits
2024 · Pruek Vanna-Iampikul, Seungmin Woo, et al. · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 16
Back-side Design Methodology for Power Delivery Network and Clock Routing
2024 · Pruek Vanna-iampikul, Hang Yang, et al. · IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) · 16
Snap-3D: A Constrained Placement-Driven Physical Design Methodology for High Performance 3-D ICs
2022 · Pruek Vanna-Iampikul, Chengjia Shao, et al. · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 12
Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits
2023 · Pruek Vanna-Iampikul, Lingjun Zhu, et al. · ACM/IEEE Design Automation Conference (DAC) · 10
Abisko: Deep codesign of an architecture for spiking neural networks using novel neuromorphic materials
2023 · Jeffrey S. Vetter, Prasanna Date, et al. · The International Journal of High Performance Computing Applications · 9
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Design Automation and Test Solutions for Monolithic 3D ICs
2021 · Lingjun Zhu, Arjun Chaudhuri, et al. · ACM Journal on Emerging Technologies in Computing Systems · 9
Spiking Transformer Hardware Accelerators in 3D Integration
2024 · Boxun Xu, Junyoung Hwang, et al. · 8
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GNN-assisted Back-side Clock Routing Methodology for Advance Technologies
2024 · Nesara Eranna Bethur, Pruek Vanna-Iampikul, et al. · ACM/IEEE Design Automation Conference (DAC) · 8
ML-based Physical Design Parameter Optimization for 3D ICs: From Parameter Selection to Optimization
2024 · Hao-Hsiang Hsiao, Pruek Vanna-Iampikul, et al. · ACM/IEEE Design Automation Conference (DAC) · 8
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GNN-based Multi-bit Flip-flop Clustering and Post-clustering Design Optimization for Energy-efficient 3D ICs
2023 · Pruek Vanna-Iampikul, Yi-Chen Lu, et al. · ACM Transactions on Design Automation of Electronic Systems · 7
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DCO-3D: Differentiable Congestion Optimization in 3D ICs
2025 · Hao-Hsiang Hsiao, Yi-Chen Lu, et al. · ACM/IEEE Design Automation Conference (DAC) · 6
RTL-to-GDS design tools for monolithic 3D ICs
2020 · Jinwoo Kim, Gauthaman Murali, et al. · 6
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GNN-MLS: Signal Routing in Mixed-Node 3D ICs through GNN-Assisted Metal Layer Sharing
2025 · Jiawei Hu, Pruek Vanna-Iampikul, et al. · ACM/IEEE Design Automation Conference (DAC) · 4
A Hybrid Reinforcement Learning Framework for Efficient Physical Design Parameter Tuning
2026 · Hao-Hsiang Hsiao, Yi-Chen Lu, et al. · ACM Transactions on Design Automation of Electronic Systems · 3
AI-Driven Evaluation and Optimization of Bump Pitch Effects on Chiplet and Interposer Design Quality
2024 · Seungmin Woo, Pruek Vanna-iampikul, et al. · 2
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Placement-Aware 3D Net-to-Pad Assignment for Array-Style Hybrid Bonding 3D ICs
2025 · Pruek Vanna-iampikul, Junsik Yoon, et al. · International Symposium on Physical Design · 1
Towards 3D Acceleration for low-power Mixture-of-Experts and Multi-Head Attention Spiking Transformers
2024 · Xu, Boxun, Hwang, Junyoung, et al. · arXiv (Cornell University) · 1
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Design and Development of a EMG Signal Acquisition System for Prosthetic Arms
2026 · Pisak Chermprayong, Pimchanok Pornchaiya, et al. · International Electrical Engineering Congress (iEECON)
Boosting Scalability and Performance: Macro Placement for Flexible 3D-Stacked ML Accelerators
2026 · Jiawei Hu, Canlin Zhang, et al. · Asia and South Pacific Design Automation Conference (ASP-DAC)
A Machine Learning–Guided Methodology for Metal Layer Sharing in Mixed-Node 3D ICs
2026 · Jiawei Hu, Pruek Vanna-Iampikul, et al. · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
2D LiDAR-Based Eucalyptus Tree Measurement and Monitoring System using Mobile Application
2025 · Pruek Vanna-Iampikul, Visutr Boonnateephisit, et al. · International Electrical Engineering Congress (iEECON)
A 3D Implementation of Convolutional Neural Network for Fast Inference
2023 · Narasinga Rao Miniskar, Pruek Vanna-Iampikul, et al. · IEEE International Symposium on Circuits and Systems proceedings
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Works count: 24
Citation count: 169
H-index: 8
I10-index: 6
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