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Jean‐Paul Clech

Observed names: Clech Jean-Paul, J. Clech, J. P. Clech, J.-P. Clech, J.-P.M. Clech, J.P. Clech, Jean-Paul Clech, Jean-Paul M. Clech
OpenAlex ID: A5073665504
Surface mount assembly failure statistics and failure free time
2002 · J.-P.M. Clech, D.M. Noctor, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 60
A comprehensive surface mount reliability model covering several generations of packaging and assembly technology
1993 · J.-P. Clech, J.C. Manock, et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 39
Review and Analysis of Lead‐Free Solder Material Properties
2007 · Jean‐Paul Clech · 38
Local CTE mismatch in SM leaded packages: a potential reliability concern
2002 · J.-P.M. Clech, F.M. Langerman, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 31
A comprehensive surface mount reliability model (CSMR) covering several generations of packaging and assembly technology
2002 · J.-P.M. Clech, J.C. Manock, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 30
Pb-Free Solder Joint Thermo-Mechanical Modeling: State of the Art and Challenges
2018 · Jean-Paul M. Clech, Richard J. Coyle, et al. · JOM · 28
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A Model of Tension and Compression Cracks With Cohesive Zone at a Bone-Cement Interface
1985 · J. P. Clech, L. M. Keer, et al. · Journal of Biomechanical Engineering · 25
Reliability figures of merit for surface-soldered leadless chip carriers compared to lead packages
1989 · J.-P.M. Clech, W. Engelmaier, et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 24
An extension of the omega method to primary and tertiary creep of lead-free solders
2005 · J.-P. Clech · IEEE Electronic Components and Technology Conference (ECTC) · 17
Flip-chip / Csp Assembly Reliability and Solder Volume Effects
2000 · J.-P.M. Clech · 16
A Crack Model of a Bone Cement Interface
1984 · J. P. Clech, L. M. Keer, et al. · Journal of Biomechanical Engineering · 12
Lead-Free Solder Joint Reliability
2007 · Jean-Paul Clech · Springer eBooks · 10
Reliability figures of merit for surface-soldered leadless chip carriers compared to leaded packages
2003 · J. Clech, W. Englemaier, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 10
An array of no-slip tensile cracks at a bimaterial interface
1986 · J.P. Clech, L.M. Keer, et al. · Engineering Fracture Mechanics · 9
Comparative Analysis of Creep Data for Sn-Ag-Cu Solder Joints in Shear
2004 · J.-P.M. Clech · 6
A finite element technique for determining mode I stress intensity factors: Application to no-slip bimaterial crack problems
1986 · J.P. Clech, J.L. Lewis, et al. · Computers & Structures · 3
Acceleration Factors and Thermal Cycling Test Efficiency for Lead-Free Sn-Ag-Cu Assemblies
2005 · Jean-Paul Clech · SMTA International · 2
Reliability Challenges and Modeling of Modern Soldered Assemblies
1997 · J.-P.M. Clech · 2
Board, Package and Die Thickness Effects Under Thermal Cycling Conditions
2015 · Jean-Paul Clech · SMTA International · 1
Mechanical Failure Processes and Models at the Bone-cement Interface.
1985 · J.-P.M. Clech, J. L. Lewis, et al. · American Society of Mechanical Engineers, Applied Mechanics Division, AMD · 1
Product Reliability
2024 · Jean-Paul Clech, Jasbir Bath · On-Demand Webinars
A Pseudo-Stress, Pseudo-Strain Methodology to Predict Lead-Free Solder Joint Reliability
2013 · Jean-Paul Clech · SMTA International
Long-Term Reliability Assessment of a New Lead-Free Area Array Connector System
2011 · Takashi Kikuchi, Gnyaneshwar Ramakrishna, et al. · Regional Events
Closed-Form, Strain-Energy Based Acceleration Factors for Thermal Cycling of Lead-Free Assemblies
2009 · Jean-Paul Clech, Gregory Henshall, et al. · SMTA International
Applicability of Various PB-Free Solder Joint Acceleration Factor Models
2006 · Ron Zhang, Jean-Paul Clech · SMTA International
Works count: 27
Citation count: 364
H-index: 11
I10-index: 13
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