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Ernesto T. Antilano
Observed names:
Antilano Ernesto,
Antilano, Ernesto,
Antilano, Ernesto T.,
Ernesto Antilano
OpenAlex ID:
A5075862735
Determination of Optimal Setting for the Tape-Based Partial Package Sawing of Wettable Flank QFN Package
2021
·
Rohn Kenneth L. Serapio
, Ernesto T. Antilano
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
4
Enabling Wettable Flank Technology: Insights, Challenges and Perspectives
2019
·
Ernesto Antilano
, Ian Harvey Arellano
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
4
Chemical Deburring as Process Solution for Eliminating Sn Metal Burrs of Wettable Flank QFN Devices
2023
·
Rohn Kenneth L. Serapio
, Ernesto T. Antilano
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
1
Understanding the Impact of Spindle Rotation Direction in the Full Cut Singulation Process of Wettable Flank QFN Packages
2022
·
Rohn Kenneth L. Serapio
, Ernesto T. Antilano
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
1
Understanding Sulfur-Induced Surface Discoloration On Pre-Plated Leadframes After Prolonged Environmental Exposure
2021
·
Salvador C. Buenviaje
, Rohn Kenneth L. Serapio
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
1
Application of Face-Centered Central Composite Design for the Optimization of Chemical Etching Process of QFN-mr Package Using Alkaline-Based Chemical Solution
2020
·
Rohn Kenneth L. Serapio
, Ernesto T. Antilano
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
1
Adhesive Contamination Removal through Improvement at Package Sawing Process
2019
·
Soreda, Alvin S.
, Antilano, Ernesto T.
·
Zenodo (CERN European Organization for Nuclear Research)
·
1
PDF
Mechanical and Chemical Treatment for Copper Burr Elimination in Wettable Flank QFN
2019
·
Antilano, Ernesto
, Arellano, Ian Harvey
·
Zenodo (CERN European Organization for Nuclear Research)
·
1
Routable Wettable Flanks for MEMS Devices
2024
·
Alex Gritti
, Andrea Ratti
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
The Use of Strip Chopping Cut Method for the Reduction of Blade Overloading in Wettable Flank QFN Half-Cut Singulation Process
2024
·
Rohn Kenneth L. Serapio
, Ernesto T. Antilano
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
Addressing Package Chip Out Corrective Action Through Point to Point Sensor to Detect Dislodge Units
2019
·
Soreda, Alvin S.
, Antilano, Ernesto T.
·
Zenodo (CERN European Organization for Nuclear Research)
PDF
Chopper Cut Set-up: Breakthrough Approach for Blade Height Accuracy
2019
·
Bacquian, Bryan Christian S.
, Antilano, Ernesto T.
·
Zenodo (CERN European Organization for Nuclear Research)
PDF
Overcoming Design Challenges on Ultra-Thin Substrate-based Packages
2019
·
Antilano, Ernesto
·
Zenodo (CERN European Organization for Nuclear Research)
Embedded Mechanical Interlock into the Silver Plating Layer for Robust Epoxy Molding Compound-To-Carrier Adhesion
2019
·
Arellano, Ian Harvey
, Antilano, Ernesto
·
Zenodo (CERN European Organization for Nuclear Research)
PDF
Ultra-Short Pulsed Laser Ablation of Epoxy Mold Compound or Copper Frames for Partial Cut QFNs
2019
·
Antilano, Ernesto
, Arellano, Ian Harvey
·
Zenodo (CERN European Organization for Nuclear Research)
NiPdAu表面上のSnの挙動への洞察:複雑な多層表面における拡散エネルギー論【Powered by NICT】
2017
·
Arellano Ian Harvey
, Antilano Ernesto
, et al.
·
Materials Letters
Insights into the behavior of Sn on NiPdAu surface: Diffusion energetics in complex multilayered surfaces
2016
·
Ian Harvey Arellano
, Ernesto Antilano
, et al.
·
Materials Letters
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Works count:
26
Citation count:
14
H-index:
2
I10-index:
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