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Author

Gerald Kreindl

Observed names: G. Kreindl, Kreindl, G., Kreindl, Gerald
Institution: EV Group (Austria)
OpenAlex ID: A5076126350
Making a good impression
2009 · Gerald Kreindl, Thomas Glinsner, et al. · Nature Photonics · 24
3D Die-to-wafer Cu/Sn Microconnects Formed Simultaneously with an Adhesive Dielectric Bond Using Thermal Compression Bonding
2008 · Scott Pozder, Ankur Jain, et al. · IEEE International Interconnect Technology Conference (IITC) · 21
Nanoimprint Lithography
2010 · Thomas Glinsner, Gerald Kreindl, et al. · Optik & Photonik · 17
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Nanoimprint lithography from CHARPAN Tool exposed master stamps with 12.5 nm hp
2011 · M. Muehlberger, M. Boehm, et al. · Microelectronic Engineering · 16
CMOS image sensor wafer-level packaging
2011 · Thorsten Matthias, Gerald Kreindl, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 14
Fully automated hot embossing processes utilizing high resolution working stamps
2009 · T. Glinsner, T. Veres, et al. · Microelectronic Engineering · 14
Fully automated hot embossing processes utilizing high resolution working stamps
2010 · T. Glinsner, T. Veres, et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 10
High accuracy UV-nanoimprint lithography step-and-repeat master stamp fabrication for wafer level camera application
2010 · G. Kreindl, T. Glinsner, et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 9
Nanoimprint Lithography
2010 · Thomas Glinsner, Gerald Kreindl · InTech eBooks · 5
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Industrial applications demanding low and high resolution features realized by soft UV-NIL and hot embossing
2009 · R. Miller, T. Glinsner, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3
Nanoimprint lithography for microfluidics manufacturing
2013 · Gerald Kreindl, Thorsten Matthias · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2
Soft UV-NIL at the 12.5 nm scale
2011 · G. Kreindl, M. Kast, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2
Enabling Wafer Level Processes for CIS Manufacturing
2010 · Eric F. Pabo, Garrett Oakes, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 2
High throughput parallel micro and nano-scale replication - a low cost alternative for the fabrication of electronic-, optic- and microfluidic devices
2012 · G. Kreindl, R. Miller, et al. · IEEE International Conference on Nanotechnology (IEEE-NANO) · 1
Nanoimprint activities in Austria in the research project cluster NILaustria
2012 · Michael Mühlberger, Hannes Fachberger, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 1
Low temperature packaging of BioMEMS and Lab-on-chip devices
2011 · Thorsten Matthias, Ron Miller, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 1
Advances in Wafer Level Processing and Integration for CIS Module Manufacturing
2010 · Bioh Kim, Thorsten Matthias, et al. · IMAPSource Proceedings · 1
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Novel Strategies for Micro-Contact Printing Based Protein-Protein Interaction Detection
2015 · Ulrike Müller, Peter Lanzerstorfer, et al. · Biophysical Journal
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High Volume Manufacturing Solution for Wafer Level Lens Molding and Stacking
2011 · Kien Mun Lau, Michael Kast, et al. · Journal of Surface Mount Technology
Wafer Level Processing and Integration Techniques for CMOS Image Sensor Module Manufacturing
2010 · Bioh Kim, Thorsten Matthias, et al. · Wafer-Level Packaging Symposium
High accuracy step-and-repeat uv imprint lithography for wafer level camera master manufacturing
2010 · G. Kreindl, T. Glinsner, et al. · IEEE International Conference on Nanotechnology (IEEE-NANO)
Fully automated hot embossing processes utilizing high resolution working stamps
2010 · T. Glinsner, T. Veres, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
New technologies: what are they?
2010 · Power, Brian, Chrysostomou, Demetrius, et al. · Swinburne figshare (Swinburne University of Technology)
Works count: 24
Citation count: 143
H-index: 8
I10-index: 7
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