Author

Siegfried Hering

Observed names: Hering, S., S. Hering

Institution: X-Fab (Germany)

Observed institution: X-Fab (Germany)

OpenAlex ID: A5077278339

Parameter Identification of Pressure Sensors by Static and Dynamic Measurements

2008 · Michael, S., Kurth, S., et al. · arXiv (Cornell University) · 5

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A Modular CMOS Foundry Process for Integrated Piezoresistive Pressure Sensors

2006 · G. Dahlmann, G. Hölzer, et al. · Springer eBooks · 4

Detailed Investgations of Inner Cavity Pressure of MEMS Devices Sealed by Wafer Bonding

2014 · Roy Knechtel, Sophia Dempwolf, et al. · ECS Transactions · 3

Trench isolated thick SOI process for various optical and high voltage devices

2013 · Ralf Lerner, Daniel Gaebler, et al. · International Semiconductor Conference Dresden-Grenoble (ISCDG) · 3

Monitoring Inner Pressure of MEMS Devices Sealed by Wafer Bonding

2013 · Roy Knechtel, Siegfried Hering, et al. · ECS Transactions · 3

Numerical Identification of Geometric Parameters from Dynamic Measurement of Grinded Membranes on Wafer Level

2006 · M. Ebert, R. Gerbach, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 3

Heat Conductivity Based Inner Cavity Pressure Monitoring and Hermeticity Monitoring for Glass Frit Wafer Bonded MEMS Devices

2021 · Roy Knechtel, Sophia Dempwolf, et al. · ECS Journal of Solid State Science and Technology · 2

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Comparison of different device concepts to increase the operating voltage of a trench isolated SOI technology to above 900V

2015 · Ralf Lerner, Klaus Schottmann, et al. · Facta universitatis - series Electronics and Energetics · 2

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A trench isolated thick SOI process as platform for various electrical and optical integrated devices

2013 · R. Lerner, D. Gaebler, et al. · IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference · 2

Monitoring Inner Pressure of MEMS Devices Sealed by Wafer Bonding

2012 · Roy Knechtel, Siegfried Hering, et al. · ECS Meeting Abstracts · 1

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B4.1 - Acceleration Sensor IP-Blocks for MEMS Foundry Surface Micromachining Process

2011 · R. Knechtel, S. Dempwolf, et al. · SENSOR International Conference on Sensors and Measurement Technology (SENSOR) · 1

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Parameter Identification on Wafer Level of Membrane Structures

2007 · Steffen Michael, Siegfried Hering, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 1

Detailed Investgations of Inner Cavity Pressure of MEMS Devices Sealed by Wafer Bonding

2014 · Roy Knechtel, Sophia Dempwolf, et al. · ECS Meeting Abstracts

Geometric Parameter Identification for Bulk-Micromachined Accelerometer from Modal Frequencies Measurements

2006 · S. Michael, M. Katzschmann, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Works count: 14

Citation count: 30

H-index: 3

I10-index: