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Michael Brökelmann

Observed names: Brökelmann, Michael, M. Brokelmann, M. Brökelmann, Michael Brokelmann
Institution: Hesse (Germany)
OpenAlex ID: A5077405263
Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding
2019 · Reinhard Schemmel, Tobias Hemsel, et al. · Sensors and Actuators A Physical · 20
Modeling of the stick-slip effect in heavy copper wire bonding to determine and reduce tool wear
2015 · Andreas Unger, Walter Sextro, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 18
Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding
2014 · Andreas Unger, Walter Sextro, et al. · 16
Bond process monitoring via self-sensing piezoelectric transducers
2005 · M. Brokelmann, J. Wallaschek, et al. · Joint Conference of the European Frequency and Time Forum and IEEE International Frequency Control Symposium (EFTF/IFCS) · 14
Influences of bonding parameters on the tool wear for copper wire bonding
2013 · Paul Eichwald, Walter Sextro, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 13
Experimental and Numerical Simulation Study of Pre-deformed Heavy Copper Wire Wedge Bonds
2014 · Andreas Unger, Walter Sextro, et al. · IMAPSource Proceedings · 12
Modeling and simulation of the ultrasonic wire bonding process
2015 · Tobias Meyer, Andreas Unger, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 11
Tactile tissue characterisation by piezoelectric systems
2007 · Ralf Stroop, David Oliva Uribe, et al. · Journal of Electroceramics · 11
Validated simulation of the ultrasonic wire bonding process
2016 · Andreas Unger, Reinhard Schemmel, et al. · IEEE CPMT Symposium Japan (ICSJ) · 10
Copper wire bonding ready for industrial mass production
2015 · M. Brökelmann, D. Siepe, et al. · IMAPSource Proceedings · 9
Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process
2018 · Collin Dymel, Paul Eichwald, et al. · Electronic System-Integration Technology Conference (ESTC) · 8
PiQC - a process integrated quality control for nondestructive evaluation of ultrasonic wire bonds
2008 · Sebastian Hagenkotter, Michael Brokelmann, et al. · Proceedings/Proceedings - IEEE Ultrasonics Symposium · 8
Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation
2016 · Tobias Meyer, Andreas Unger, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7
Effects of different working frequencies on the joint formation in copper wire bonding
2018 · Reinhard Schemmel, Simon Althoff, et al. · 6
Micro wear modeling in copper wire wedge bonding
2016 · Paul Eichwald, Andreas Unger, et al. · IEEE CPMT Symposium Japan (ICSJ) · 6
A simple transducer model for longitudinal flip-chip bonding
2003 · T. Sattel, M. Brokelmann · Proceedings/Proceedings - IEEE Ultrasonics Symposium · 6
Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding
2018 · Collin Dymel, Reinhard Schemmel, et al. · IEEE CPMT Symposium Japan (ICSJ) · 5
Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges
2018 · Andreas Unger, Matthias Hunstig, et al. · IMAPSource Proceedings · 4
Process advantages of thermosonic wedge-wedge bonding using dosed tool heating
2019 · Matthias Hunstig, Andreas Unger, et al. · IMAPSource Proceedings · 3
Thermosonic wedge-wedge bonding using dosed tool heating
2019 · Andreas Unger, Matthias Hunstig, et al. · European Microelectronics and Packaging Conference · 3
Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design
2017 · Paul Eichwald, Simon Althoff, et al. · IMAPSource Proceedings · 2
Study of Real-time Filtering for an Inertial Measurement Unit (IMU) with Magnetometer in a 155mm Projectile
2006 · V. Fleck, E. Sommer, et al. · IEEE/ION Position Location and Navigation Symposium · 2
Cell Interconnections in Battery Packs Using Laser-assisted Ultrasonic Wire Bonding
2020 · Andreas Unger, Matthias Hunstig, et al. · IMAPSource Proceedings · 1
Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding
2019 · Reinhard Schemmel, Florian Eacock, et al. · IMAPSource Proceedings · 1
Mehrzieloptimierung und Verhaltensanpassung am Bondautomaten
2018 · Tobias Meyer, Andreas Unger, et al. · Intelligente Technische Systeme, Lösungen aus dem Spitzencluster it’s OWL · 1
Works count: 38
Citation count: 200
H-index: 9
I10-index: 9
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