Author

Vance Liu

Observed name: Vance LIU

Institutions: Micron (United States), National Chung Hsing University, Micron (Taiwan)

Observed institutions: Micron (United States), Johns Hopkins University, National Chung Hsing University, Micron (Taiwan)

ORCID: 0000-0002-9401-9583

Observed ORCID: 0000-0002-9401-9583

OpenAlex ID: A5077467110

Deformation assisted nucleation of continuous nanoprecipitates in Mg–Al alloys

2019 · Suhas Eswarappa Prameela, Peng Yi, et al. · Materialia · 31

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Solder joint reliability performance study and shear characterization of low-Ag SAC lead-free solders for handheld application

2024 · Vance Liu, Yung-Sheng Zou, et al. · Materials Science in Semiconductor Processing · 24

Mechanical Suite of Flexural Bending Method for Electronic Memory Packages

2021 · Vance Liu, Shams Arifeen, et al. · IEEE International Conference on Sensors and Nanotechnology (SENNANO) · 12

Substrate Copper Trace Crack Characterization and Simulation

2023 · Wei Yu, Faxing Che, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 9

Effect of Second Phase Particle Size on the Recrystallized Microstructure of Mg–Al Alloys Following ECAE Processing

2020 · Suhas Eswarappa Prameela, Peng Yi, et al. · The minerals, metals & materials series · 9

Effects of Epoxy Molding Compound on managed NAND(mNAND) package strain enhancement

2021 · Joyce Chen, Vance Liu, et al. · International Conference on Electronics Packaging (ICEP) · 7

Study of robust package strength characterization of memory packages for handheld application

2022 · Vance Liu, Chien-Ming Chen, et al. · Memories - Materials Devices Circuits and Systems · 6

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Comparative study of solder joint reliability assessment on fan-out CSP and flip-chip DCA package

2023 · Vance Liu, Koustav Sinha, et al. · Journal of Materials Science Materials in Electronics · 5

Comparative Study of Solder Strength Characterization for BGA Packages

2021 · Vance Liu, Show Lai, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 5

Study of solder joint reliability performance and component shear Property of hybrid low temperature solder joints

2025 · Vance Liu, Yan-Sen Liao, et al. · Materials Science in Semiconductor Processing · 4

Single Factor Study of Solder Joint Reliability for MCP Packages

2023 · Vance Liu, Chien-Min Chen, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 4

Solder Joint Reliability Assessment on FO-CSP for Next Generation DDR6

2022 · Vance Liu, Jian-Ming Chen, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 3

An Overview of Substrate Copper Trace Crack Through Experiments, Characterization, and Numerical Simulations

2025 · Wei Yu, Faxing Che, et al. · Micromachines · 2

The Shift-Left Die Strength Analysis Method for Memory Die Products

2022 · Vance Liu, Yi-Chen Wang, et al. · International Conference on Electronics Packaging (ICEP) · 2

Thermomechanical, mechanical, and physical characterization study of epoxy molding compound of memory packages under high-temperature aging

2026 · Vance Liu, Yun-Ying Chen, et al. · Journal of Materials Science Materials in Electronics · 1

Enhancing Predictive Accuracy of Warpage and Reliability for Advanced Packages by Modelling Accurate Poisson's Ratio in Finite Element Analysis

2025 · Fa Xing CHE, Vance LIU, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 1

High-speed Solder Ball Shear Test and Component Shear Test for Evaluating the Robustness of Solder Joints under Different Reflow Profiles

2025 · Y. Y. Chen, Y. S. Zou, et al. · International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

Creep Viscoplastic Characterization of SAC Solders Exposed to Different Isothermal Aging

2023 · Vance Liu, Sih-Tung Lin, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Works count: 18

Citation count: 125

H-index: 6

I10-index: 3