Product
Help
Pricing
About
Jobs
Log in
Get started
Author
Add to collection
Fakhrozi Che Ani
Observed names:
F CHE ANI,
F Che Ani,
F. C. Ani,
F. Che Ani,
F.C. Ani
Institutions:
Western Digital (United States),
National University of Malaysia
Observed institutions:
Western Digital (Japan),
Universiti Sains Malaysia,
Malaysia Genome Institute,
Western Digital (United States),
National University of Malaysia
ORCID:
0000-0001-7023-5591
Observed ORCID:
0000-0001-7023-5591
OpenAlex ID:
A5078970936
Three-dimensional numerical and experimental investigations on polymer rheology in meso-scale injection molding
2009
·
C.Y. Khor
, Z.M. Ariff
, et al.
·
International Communications in Heat and Mass Transfer
·
58
FVM based numerical study on the effect of solder bump arrangement on capillary driven flip chip underfill process
2009
·
C.Y. Khor
, M.Z. Abdullah
, et al.
·
International Communications in Heat and Mass Transfer
·
52
CFD modeling of pin shape effects on capillary flow during wave soldering
2014
·
M.S. Abdul Aziz
, M.Z. Abdullah
, et al.
·
International Journal of Heat and Mass Transfer
·
51
Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process
2012
·
Chun‐Sean Lau
, M.Z. Abdullah
, et al.
·
Soldering and Surface Mount Technology
·
51
Effect of ILU dispensing types for different solder bump arrangements on CUF encapsulation process
2016
·
Aizat Abas
, Haslinda M.S.
, et al.
·
Microelectronic Engineering
·
42
Influence of pin offset in PCB through-hole during wave soldering process: CFD modeling approach
2013
·
M.S. Abdul Aziz
, M.Z. Abdullah
, et al.
·
International Communications in Heat and Mass Transfer
·
42
Finite volume based CFD simulation of pressurized flip-chip underfill encapsulation process
2009
·
C.Y. Khor
, M. Abdul Mujeebu
, et al.
·
Microelectronics Reliability
·
40
Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings
2017
·
Fei Chong Ng
, Aizat Abas
, et al.
·
Microelectronics Reliability
·
39
Hydrophobicity performance of polyethylene terephthalate (PET) and thermoplastic polyurethane (TPU) with thermal effect
2018
·
S Jasmee
, G Omar
, et al.
·
Materials Research Express
·
38
PDF
Lattice Boltzmann method study of bga bump arrangements on void formation
2015
·
Aizat Abas
, M.H.H. Ishak
, et al.
·
Microelectronics Reliability
·
38
SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly
2018
·
Fakhrozi Che Ani
, Azman Jalar
, et al.
·
Soldering and Surface Mount Technology
·
37
Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder by nanoindentation
2016
·
Muhamad Zamri Yahaya
, Fakhrozi Che Ani
, et al.
·
Materials Science and Engineering A
·
36
Study on the fluid/structure interaction at different inlet pressures in molded packaging
2011
·
C.Y. Khor
, M.Z. Abdullah
, et al.
·
Microelectronic Engineering
·
36
The influence of Fe2O3 nano-reinforced SAC lead-free solder in the ultra-fine electronics assembly
2018
·
F. Che Ani
, A. Jalar
, et al.
·
The International Journal of Advanced Manufacturing Technology
·
35
Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering
2017
·
A.M. Najib
, M.Z. Abdullah
, et al.
·
Microelectronics Reliability
·
35
Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method
2012
·
Chun-Sean Lau
, M.Z. Abdullah
, et al.
·
Microelectronics Reliability
·
35
Effect of Solder Joint Arrangements on BGA Lead-Free Reliability During Cooling Stage of Reflow Soldering Process
2012
·
Chun-Sean Lau
, Mohd Zulkifly Abdullah
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
31
Three‐dimensional thermal investigations at board level in a reflow oven using thermal‐coupling method
2012
·
Chun‐Sean Lau
, M.Z. Abdullah
, et al.
·
Soldering and Surface Mount Technology
·
31
Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test
2024
·
Rilwan Kayode Apalowo
, Mohamad Aizat Abas
, et al.
·
Soldering and Surface Mount Technology
·
26
Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly
2018
·
Fakhrozi Che Ani
, Azman Jalar
, et al.
·
Soldering and Surface Mount Technology
·
25
Alternative manufacturing process of 3-dimensional interconnect device using thermoforming process
2021
·
S. Zulfiqar
, A.A. Saad
, et al.
·
Microelectronics Reliability
·
21
Underfill process for two parallel plates and flip chip packaging
2012
·
C.Y. Khor
, M.Z. Abdullah
, et al.
·
International Communications in Heat and Mass Transfer
·
20
Finite volume-based simulation of the wave soldering process: Influence of the conveyor angle on pin-through-hole capillary flow
2015
·
M. S. Abdul Aziz
, M. Z. Abdullah
, et al.
·
Numerical Heat Transfer Part A Applications
·
19
YOLOv8-DEE: a high-precision model for printed circuit board defect detection
2024
·
Feifan Yi
, Ahmad Sufril Azlan Mohamed
, et al.
·
PeerJ Computer Science
·
18
Investigation of hygrothermally induced failures in multilayer ceramic capacitors during thermal reflow process
2023
·
Rilwan Kayode Apalowo
, Aizat Abas
, et al.
·
Microelectronics Reliability
·
18
Show more works
View as search
Works count:
97
Citation count:
1,228
H-index:
21
I10-index:
37
Year
Topic
Type
