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Yoshinari Ikeda

Observed names: Y. Ikeda, Yoshinari IKEDA
ORCID: 0009-0003-9995-6095
Observed ORCID: 0009-0003-9995-6095
OpenAlex ID: A5079290368
Full SiC power module with advanced structure and its solar inverter application
2013 · Yuichiro Hinata, Masafumi Horio, et al. · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · 54
Investigation on wirebond-less power module structure with high-density packaging and high reliability
2011 · Yoshinari Ikeda, Yuji Iizuka, et al. · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · 46
Direct liquid cooling module with high reliability solder joining technology for automotive applications
2013 · Akira Morozumi, Hiroaki Hokazono, et al. · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · 39
Ultra compact and high reliable SiC MOSFET power module with 200°C operating capability
2012 · Masafumi Horio, Yuji Iizuka, et al. · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · 37
All-SiC power module for photovoltaic Power Conditioner System
2014 · Norihiro Nashida, Yuichiro Hinata, et al. · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · 24
New reverse-conducting IGBT (1200V) with revolutionary compact package
2014 · K. Takahashi, S. Yoshida, et al. · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · 18
Reliability of pressure-free Cu nanoparticle joints for power electronic devices
2019 · Y. Yamada, K. Hasegawa, et al. · Microelectronics Reliability · 15
Advanced thin wafer IGBTs with new thermal management solution
2004 · M. Otsuki, H. Kanemaru, et al. · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · 15
Universal Smart Power Module (USPM) for Carbon Neutral Society
2022 · Yoshikazu Takahashi, Yoshinari Ikeda, et al. · International Power Electronics Conference (IPEC) · 14
Ultra compact, low thermal impedance and high reliability module structure with SiC Schottky Barrier Diodes
2011 · Yoshinari Ikeda, Norihiro Nashida, et al. · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · 12
Study on Thermal Performance of Lead Frame Interconnection to Power Devices
2004 · Yoshinari IKEDA, Katsuhiko YOSHIHARA, et al. · The proceedings of the JSME annual meeting · 12
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Design optimization of heat sink using additive manufacturing
2017 · Y. Tateishi, V. Parque, et al. · IEEE CPMT Symposium Japan (ICSJ) · 11
New reverse-conducting IGBT (1200V) with revolutionary compact package
2014 · K. Takahashi, S. Yoshida, et al. · International Power Electronics Conference (IPEC) · 11
Basic study on partial discharge location in power module
2016 · Hiroshi Mitsudome, Yuuya Akinaga, et al. · IEEE International Conference on Dielectrics (ICD) · 10
Universal Smart Power Module (USPM) for Carbon Neutral Society
2024 · Hiroki Watanabe, Koki Yamanokuchi, et al. · IEEE Transactions on Industry Applications · 9
Heatsink design using spiral-fins considering additive manufacturing
2019 · Shingo Otake, Yoshihiro Tateishi, et al. · International Conference on Electronics Packaging (ICEP) · 9
High accuracy partial discharge location in power module using multiple loop sensors
2017 · Hiroshi Mitsudome, Yuuya Akinaga, et al. · IEEE International Workshop on Integrated Power Packaging (IWIPP) · 9
Characteristics of the Power Electronics Equipments applying the SiC power devices
2012 · Yasushi Matsumoto, Ryuji Yamada, et al. · International Conference on Power Engineering and Renewable Energy (ICPERE) · 9
About Present Condition and Outlook of Packaging Technology for a Power Semiconductor Module
2015 · Yoshinari IKEDA, Yoshitaka NISHIMURA, et al. · Journal of Smart Processing · 7
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3.3kV All-SiC Module for Electric Distribution Equipment
2018 · Ryohei Takayanagi, Katsumi Taniguchi, et al. · International Power Electronics Conference (IPEC) · 6
Technical Trend of Packaging for Power Semiconductor Modules
2013 · Yoshikazu Takahashi, Akira Morozumi, et al. · Journal of The Japan Institute of Electronics Packaging · 6
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A study on the reliability of the chip surface solder joint
2008 · Yoshinari Ikeda, Yuji Iizuka, et al. · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · 6
Enhanced breakdown voltage for all-SiC modules
2017 · Motohito Hori, Yuichiro Hinata, et al. · IEEE CPMT Symposium Japan (ICSJ) · 5
Propagation characteristics of acoustic wave induced by partial discharge in IGBT module
2017 · Jyunya Maki, Yuya Akinaga, et al. · International Symposium on Electrical Insulating Materials (ISEIM) · 5
Compact, Low Loss and High Reliable 3.3kV Hybrid Power Module
2016 · Satoshi Kaneko, Naoyuki Kanai, et al. · 5
Works count: 47
Citation count: 425
H-index: 11
I10-index: 14
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