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Jeong-Hoon Moon

Observed names: Jeong Hoon Moon, Jeonghoon Moon, Moon Jeong-Hoon, 문정훈
Institution: Chosun University
ORCID: 0000-0002-1941-4022
Observed ORCID: 0000-0002-1941-4022
OpenAlex ID: A5081713901
A Novel High-Speed Resonant Frequency Tracking Method Using Transient Characteristics in a Piezoelectric Transducer
2022 · Jeonghoon Moon, Sungjun Park, et al. · Sensors · 29
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Mechanical Reliability of the Epoxy Sn-58wt.%Bi Solder Joints with Different Surface Finishes Under Thermal Shock
2018 · Yong-Gue Sung, Woo-Ram Myung, et al. · Journal of Electronic Materials · 20
Mechanical and Electrical Properties of Cu/Sn-3.5Ag/Cu Ball Grid Array (BGA) Solder Joints after Multiple Reflows
2007 · Ja-Myeong Koo, Bui Quoc Vu, et al. · Journal of Electronic Materials · 19
Formation of double-layered TiO2 structures with selectively-positioned molecular dyes for efficient flexible dye-sensitized solar cells
2013 · Eun Yi Kim, Sora Yu, et al. · Electrochimica Acta · 14
Fast and Stable Synchronization Between the Grid and Generator by Virtual Coordinates and Feed-Forward Compensation in Grid-Tied Uninterruptible Power Supply System
2021 · Jeong Hoon Moon, Hyoung Mook Lee, et al. · IEEE Access · 9
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Effect of Atmospheric Pressure Plasma Treatment on Transverse Ultrasonic Bonding of Gold Flip-Chip Bump on Glass Substrate
2008 · Ja-Myeong Koo, Jung-Lae Jo, et al. · Japanese Journal of Applied Physics · 9
Interface control with layer-by-layer assembled ionic polymers for efficient low-temperature dye-sensitized solar cells
2012 · Kyeong Ha Kim, Jeong Hoon Moon, et al. · Journal of Materials Chemistry · 8
Ultrasonic Bonding Technology for Flip Chip Packaging
2008 · Ja-Myeong Koo, Jong-Woong Kim, et al. · Journal of Welding and Joining · 7
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Flip-chip Bonding Technology and Reliability of Electronic Packaging
2007 · Jeong-Won Yoon, Jong-Woong Kim, et al. · Journal of Welding and Joining · 7
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Thermo-Mechanical Reliability of Lead-Free Surface Mount Assemblies for Auto-Mobile Application
2006 · 하상수, 김종웅, et al. · Journal of Welding and Joining · 7
Joint Characteristics of Spot Friction Stir Welded 5052 Al Alloy Sheet
2006 · Chang Yong Lee, Won Bae Lee, et al. · Advanced materials research · 5
A Study on the Mechanical Resonance Frequency of a Piezo Element: Analysis of Resonance Characteristics and Frequency Estimation Using a Long Short-Term Memory Model
2024 · Jeonghoon Moon, Sangkil Lim, et al. · Applied Sciences · 4
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3d 패키지용 관통 전극 형성에 관한 연구
2006 · 김대곤, 김종웅, et al. · Journal of Welding and Joining · 3
Effect of Surface Treatment on the Mechanical Strength of Ultrasonically Bonded Chip on Copper-Coated Glass for Ultra-Fine Pitch Application in Microelectronics
2009 · Jung-Lae Jo, Jong-Bum Lee, et al. · Japanese Journal of Applied Physics · 1
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Sensor-Level Anomaly Detection in DC–DC Buck Converters with a Physics-Informed LSTM: DSP-Based Validation of Detection and a Simulation Study of CI-Guided Deception
2025 · Jeong-Hoon Moon, Jin-Hong Kim, et al. · Applied Sciences
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Bonding Strength of the Sn-58Bi Jointed IC Card Component Bonded by Ultrasonic Energy
2017 · Woo-Ram Myung, Yong-Gue Sung, et al. · Nanoscience and Nanotechnology Letters
A study about gate driver for high speed switching
2016 · Jeong-Hoon Moon, Ji-Hoon Yang, et al. · IEEE Transportation Electrification Conference and Expo, Asia-Pacific (ITEC Asia-Pacific)
3P1-9 Sn-58Biハンダを使ったICカードパッケージ用Cu-Cu超音波溶接の信頼性(ポスターセッション)
2013 · Myung Woo-Ram, Jeong-Hoon Moon, et al. · 超音波エレクトロニクスの基礎と応用に関するシンポジウム講演論文集
2P-11 Evaluation of metal weld-zone by using Poisson's ratio distribution(Poster Session)
2010 · Jong Yeon Lee, Young H. Kirn, et al. · 超音波エレクトロニクスの基礎と応用に関するシンポジウム講演論文集
1Pb-44 小型電子部品の超音波接合とその評価(ポスターセッション)
2010 · Seong H. Yeon, Young H. Kim, et al. · 超音波エレクトロニクスの基礎と応用に関するシンポジウム講演論文集
2p-11 ポアソン比の分布による金属溶接部の評価(ポスターセッション)
2010 · Y Lee Jong, H Kirn Young, et al. · 超音波エレクトロニクスの基礎と応用に関するシンポジウム講演論文集
Effect of Atmospheric-Pressure Plasma Treatment on the Joint Strength between Au Flip Chip Bumps and Cu-Finished Si Wafer Substrates Bonded Using Ultrasonic Energy
2009 · Jung-Lae Jo, Ja-Myeong Koo, et al. · Journal of the Korean Physical Society
1p1-11 大気圧プラズマ処理の超音波バンプボンディングにおよぼす影響(ポスターセッション)
2008 · Jung-Lae Jo, Ja‐Myeong Koo, et al. · 超音波エレクトロニクスの基礎と応用に関するシンポジウム講演論文集
2p8-10 マイクロ電子部品用超音波ホーンの設計(ポスターセッション)
2008 · Minseok Bae, H Kim Young, et al. · 超音波エレクトロニクスの基礎と応用に関するシンポジウム講演論文集
Reliability Evaluation of Electronic Circuit Printed Using Metallic Ink
2008 · Ja-Myeong Koo, Jong-Bum Lee, et al. · Journal of Welding and Joining
Works count: 32
Citation count: 142
H-index: 7
I10-index: 4
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