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Author

Margie Li

Observed institution: ASM Pacific Technology (China)
OpenAlex ID: A5084843301
Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging
2017 · John H. Lau, Ming Li, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 173
Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging With Large Chips and Multiple Redistributed Layers
2018 · John H. Lau, Ming Li, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 59
Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration
2018 · Cheng-Ta Ko, Henry Yang, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 55
Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging
2017 · John Lau, Ming Li, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 47
Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)
2017 · John Lau, Ming Li, et al. · Journal of Microelectronics and Electronic Packaging · 42
Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration
2018 · Cheng-Ta Ko, Chieh-Lin Chang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 36
Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration
2018 · Cheng-Ta Ko, Henry Yang, et al. · Journal of Microelectronics and Electronic Packaging · 31
Reliability of Fan-Out Wafer-Level Heterogeneous Integration
2018 · John Lau, Ming Li, et al. · Journal of Microelectronics and Electronic Packaging · 26
Fan-Out Wafer-Level Packaging for Heterogeneous Integration
2018 · John Lau, Zhang Li, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 24
Development of chip-first and die-up fan-out wafer level packaging
2017 · Xuan Hua, Hong Xu, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 20
Reliability of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Re-Distributed Layers
2018 · John Lau, Eric Kuah, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 19
Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs)
2017 · John Lau, Ming Li, et al. · IMAPSource Proceedings · 10
Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Redistributed Layers
2018 · John Lau, Wu Kai, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 6
Reliability of Fan-Out Wafer-Level Heterogeneous Integration
2018 · John Lau, Ming Li, et al. · IMAPSource Proceedings · 4
Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration
2018 · Cheng-Ta Ko, Henry Yang, et al. · IMAPSource Proceedings · 3
Challenges of Large Format Packaging and Some of Its Assembly Solutions
2017 · TH Eric Kuah, Hao Ji Yuan, et al. · IMAPSource Proceedings · 2
Works count: 16
Citation count: 557
H-index: 11
I10-index: 12
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