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Yanfu Yan
Observed names:
Y YANFU,
Yan Yanfu,
Yan, Yanfu,
Yan-fu,
Yan-fu YAN,
Yan-fu Yan,
Yanfu YAN
show all 7
Institution:
Zhejiang University
Observed institutions:
William & Mary,
Henan University of Science and Technology,
Chinese Academy of Sciences,
Beijing University of Technology,
University of Chinese Academy of Sciences,
Beijing Polytechnic University,
Zhejiang University
show all 7
ORCID:
0009-0008-2475-6802
Observed ORCIDs:
0009-0008-2475-6802,
0000-0003-4779-1957
OpenAlex ID:
A5087535289
Properties of lead-free solder SnAgCu containing minute amounts of rare earth
2003
·
Zhigang Chen
, Yaowu Shi
, et al.
·
Journal of Electronic Materials
·
85
Light Attention Embedding for Facial Expression Recognition
2021
·
Cong Wang
, Jian Xue
, et al.
·
IEEE Transactions on Circuits and Systems for Video Technology
·
45
Creep Properties of Composite Solders Reinforced with Nano- and Microsized Particles
2007
·
Yaowu Shi
, Jianping Liu
, et al.
·
Journal of Electronic Materials
·
44
The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder
2020
·
Chaojun Li
, Yanfu Yan
, et al.
·
Materials
·
34
PDF
FEAFA: A Well-Annotated Dataset for Facial Expression Analysis and 3D Facial Animation
2019
·
Yanfu Yan
, Ke Lu
, et al.
·
IEEE International Conference on Multimedia & Expo Workshops (ICMEW)
·
32
PDF
Influence of Mg and Ti on the microstructure and electrochemical performance of aluminum alloy sacrificial anodes
2009
·
Jingling Ma
, Jiuba Wen
, et al.
·
Rare Metals
·
26
Intermetallic growth study at Sn–3.0Ag–0.5Cu/Cu solder joint interface during different thermal conditions
2015
·
Shuai Li
, Yan-fu Yan
·
Journal of Materials Science Materials in Electronics
·
21
The influence of Ag on the microstructure, thermal properties and mechanical behavior of Sn–25Sb-xAg high temperature lead-free solder
2020
·
Chaojun Li
, Yanfu Yan
, et al.
·
Vacuum
·
16
Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles
2009
·
Yaowu Shi
, Yanfu Yan
, et al.
·
Journal of Electronic Materials
·
16
Semantic GUI Scene Learning and Video Alignment for Detecting Duplicate Video-based Bug Reports
2024
·
Yanfu Yan
, Nathan Cooper
, et al.
·
ACM/IEEE International Conference on Software Engineering: Companion Proceedings (ICSE-Companion)
·
15
PDF
LLM Agents Can See Code Repositories
2026
·
Dongjian Ma
, Silin Chen
, et al.
·
IEEE/ACM International Conference on Automated Software Engineering (ASE)
·
14
Enhancing Code Understanding for Impact Analysis by Combining Transformers and Program Dependence Graphs
2024
·
Yanfu Yan
, Nathan Cooper
, et al.
·
Proceedings of the ACM on software engineering.
·
14
FEAFA+: an extended well-annotated dataset for facial expression analysis and 3D facial animation
2022
·
Wei Gan
, Jian Xue
, et al.
·
International Conference on Digital Image Processing
·
13
PDF
Creep behavior on Ag particle reinforced SnCu based composite solder joints
2006
·
Yan-fu YAN
, Jin-hong ZHU
, et al.
·
Transactions of Nonferrous Metals Society of China
·
12
Study on Cu particles-enhanced SnPb composite solder
2004
·
Yanfu Yan
, Jianping Liu
, et al.
·
Journal of Electronic Materials
·
10
ACER: An AST-based Call Graph Generator Framework
2023
·
Andrew Chen
, Yanfu Yan
, et al.
·
IEEE International Working Conference on Source Code Analysis and Manipulation (SCAM)
·
8
PDF
Constitutive modeling on creep deformation for a SnPb-based composite solder reinforced with microsized Cu particles
2010
·
Yaowu Shi
, Yanfu Yan
, et al.
·
Microelectronics Reliability
·
8
Hydrothermal solvothermal synthesis potassium sodium niobate lead-free piezoelectric ceramics assisted with microwave
2017
·
Haitao Li
, Yanfu Yan
, et al.
·
Journal of Materials Science Materials in Electronics
·
7
Effect of Ag and Ni on the melting point and solderability of SnSbCu solder alloys
2009
·
Yan-fu
, Yan yan
, et al.
·
International Journal of Minerals Metallurgy and Materials
·
7
Preparation of Sn42Bi58 and Sn64.7Bi35Ag0.3 soldering pastes for Cu–Al direct soldering and study of their performance
2025
·
Ruofan Wang
, Yanfu Yan
, et al.
·
Materials Chemistry and Physics
·
6
Influence of temperature on creep behavior of ag particle enhancement SnCu based composite solder
2007
·
Yanfu Yan
, Lifang Feng
, et al.
·
Tsinghua Science & Technology
·
6
R-FENet: A Region-based Facial Expression Recognition Method Inspired by Semantic Information of Action Units
2020
·
Cong Wang
, Ke Lu
, et al.
·
International Workshop on Human-centric Multimedia Analysis (HCMA)
·
5
Dense Attention Network for Facial Expression Recognition in the Wild
2019
·
Cong Wang
, Ke Lu
, et al.
·
ACM International Conference on Multimedia in Asia (MMAsia)
·
5
Influence of stress on the creep behavior of Cu particle enhancement SnPb based composite solder joints
2007
·
Y YANFU
, Y HONGXING
, et al.
·
Rare Metals
·
5
Towards More Trustworthy Deep Code Models by Enabling Out-of-Distribution Detection
2025
·
Yanfu Yan
, Viet Duong
, et al.
·
ACM/IEEE International Conference on Software Engineering: Companion Proceedings (ICSE-Companion)
·
4
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Works count:
60
Citation count:
482
H-index:
13
I10-index:
15
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