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Raphael Adamietz
Observed names:
Adamietz, R.,
Adamietz, Raphael,
R Adamietz,
R. Adamietz
Observed institutions:
Fraunhofer Institute for Manufacturing Engineering and Automation,
Fraunhofer-Gesellschaft,
KTH Royal Institute of Technology
ORCID:
0000-0002-0935-1750
Observed ORCID:
0000-0002-0935-1750
OpenAlex ID:
A5088166676
A modular flexible scalable and reconfigurable system for manufacturing of Microsystems based on additive manufacturing and e-printing
2016
·
Steffen Scholz
, Tobias Mueller
, et al.
·
Robotics and Computer-Integrated Manufacturing
·
37
Evolvable assembly systems: coping with variations through evolution
2008
·
D. Semere
, M. Onori
, et al.
·
Assembly Automation
·
31
Reconfigurable and transportable container-integrated production system
2018
·
Raphael Adamietz
, Tim Giesen
, et al.
·
Robotics and Computer-Integrated Manufacturing
·
23
Laser-assisted modification of polymers for microfluidic, micro-optics, and cell culture applications
2007
·
W. Pfleging
, R. Adamietz
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
19
Encapsulation of Microelectronic Components Using Open-Ended Microwave Oven
2012
·
Sumanth Kumar Pavuluri
, Marju Ferenets
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
14
Reliability Testing and Stress Measurement of QFN Packages Encapsulated by an Open-Ended Microwave Curing System
2018
·
Raphael Adamietz
, Marc P. Y. Desmulliez
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
8
Experimental investigation of open-ended microwave oven assisted encapsulation process
2010
·
S.K. Pavuluri
, M. Ferenets
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
4
A First Step towards Cross-Platform Integration in Modular Micro-assembly Systems – Concept for a Process Module Construction Kit
2013
·
Raphael Adamietz
, Tobias Iseringhausen
, et al.
·
Springer eBooks
·
3
Post cure behaviour of encapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator
2011
·
S.K. Pavuluri
, M. P. Y. Desmulliez
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
3
On the integration of microwave curing systems into microelectronics assembly processes
2010
·
R. Adamietz
, G. Muller
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
3
Modular microwave-based system for packaging applications
2010
·
Raphael Adamietz
, T. Tilford
, et al.
·
Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft)
·
2
A modular flexible scalable and reconfigurable system for manufacturing of microsystems based on additive manufacturing and e-printing
2014
·
Christian Woegerer
, Matthias Plasch
, et al.
·
International Conference on Flexible Automation and Integrated Manufacturing (FAIM)
·
1
An Additive Manufacturing and E-Printing Based Approach for Flexible Scalable Manufacturing of Microsystems
2013
·
Markus Dickerhof
, Daniel Kimmig
, et al.
·
International Conference on Multi-Material Micro Manufacture (4M)
·
1
Assessment of the accuracy of cure kinetics models and fitting approaches utilised in analysis of microelectronics encapsulation materials
2011
·
T. Tilford
, M. Ferenets
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
1
Numerical analysis of microwave underfill cure in ball-grid packages
2010
·
T. Tilford
, M. Ferenets
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
1
A Concept for Flexible Battery Cell Manufacturing from Low to Medium Volumes
2017
·
T. Giesen
, Raphael Adamietz
, et al.
·
Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft)
Modular Workpiece Carrier System for Micro Production
2014
·
Tobias Iseringhausen
, Raphael Adamietz
, et al.
·
Lecture notes in computer science
PDF
Process Module Construction Kit for Modular Micro Assembly Systems
2014
·
Raphael Adamietz
, Tobias Iseringhausen
, et al.
·
Lecture notes in computer science
PDF
A generative manufacturing-based concept for flexible, scalable manufacturing of microsystems.
2014
·
Markus Dickerhof
, Daniel Kimmig
, et al.
The SMARTLAM 3D-I Concept: Design of Microsystems from Functional Elements Fabricated by Generative Manufacturing Technologies
2014
·
Markus Dickerhof
, Daniel Kimmig
, et al.
·
IFIP advances in information and communication technology
A Microwave curing system for microelectronics assembly
2012
·
R. Adamietz
, T. Tilford
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
Open-ended single mode resonant applicator for microelectronics packaging applications
2011
·
Sumanth Kumar Pavuluri
, George Goussetis
, et al.
·
Greenwich Academic Literature Archive (University of Greenwich)
Advances in the design and test of a novel open ended microwave oven
2010
·
Sumanth Kumar Pavuluri
, T. Tilford
, et al.
·
Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft)
Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages
2010
·
T. Tilford
, M. Ferenets
, et al.
·
Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft)
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Works count:
39
Citation count:
151
H-index:
6
I10-index:
5
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