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Thomas Wagenleitner
Observed name:
T. Wagenleitner
Institution:
EV Group (Austria)
Observed institution:
EV Group (Austria)
OpenAlex ID:
A5088214525
Advances in SiCN-SiCN Bonding with High Accuracy Wafer-to-Wafer (W2W) Stacking Technology
2018
·
L. Peng
, S-W Kim
, et al.
·
IEEE International Interconnect Technology Conference (IITC)
·
49
200 nm Wafer-to-wafer overlay accuracy in wafer level Cu/SiO2 hybrid bonding for BSI CIS
2015
·
B. Rebhan
, M. Bernauer
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
24
High Precision Low Temperature Direct Wafer Bonding Technology for Wafer-Level 3D ICs Manufacturing
2016
·
Florian Kurz
, Thomas Plach
, et al.
·
ECS Transactions
·
14
Monolithic IC integration key alignment aspects for high process yield
2014
·
Thomas Uhrmann
, Thomas Wagenleitner
, et al.
·
IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference
·
10
Results on aligned SiO2/SiO2 direct wafer-to-wafer low temperature bonding for 3D integration
2009
·
A. Garnier
, M. Angermayer
, et al.
·
IEEE International SOI Conference (SOI)
·
9
(Invited) High Accuracy Aligned Wafer Bonding for Wafer-Level Integration
2018
·
Thomas Plach
, Bernhard Rebhan
, et al.
·
ECS Transactions
·
7
PDF
3D-SoC integration utilizing high accuracy wafer level bonding
2016
·
Lan Peng
, Soon-Wook Kim
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
4
Influencing factors in high precision fusion wafer bonding for monolithic integration
2015
·
Thomas Uhrmann
, Florian Kurz
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
3
Metal wafer bonding for 3D interconnects and advanced packaging
2012
·
V. Dragoi
, E. Pabo
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
·
3
CMOS-compatible aligned fusion wafer bonding
2011
·
V. Dragoi
, G. Mittendorfer
, et al.
·
CAS proceedings
·
3
(Invited) High Accuracy Aligned Wafer Bonding for Wafer-Level Integration
2018
·
Thomas Plach
, Bernhard Rebhan
, et al.
·
ECS Meeting Abstracts
·
2
Wafer bonding for CMOS integration and packaging
2012
·
V. Dragoi
, F. Kurz
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
·
2
Wafer Bonding for Backside Illuminated Image Sensors
2012
·
Thorsten Matthias
, Thomas Uhrmann
, et al.
·
ECS Transactions
·
2
Fusion bonding for next- generation 3D-ICs
2014
·
Thomas Uhrmann
, Thorsten Matthias
, et al.
·
1
High Precision Low Temperature Direct Wafer Bonding Technology for Wafer-Level 3D ICs Manufacturing
2016
·
Florian Kurz
, Thomas Plach
, et al.
·
ECS Meeting Abstracts
Hybrid Bonding for 3D Integration
2015
·
Markus Wimplinger
, Florian Kurz
, et al.
·
Pan Pacific Symposium
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Works count:
16
Citation count:
133
H-index:
6
I10-index:
4
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