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Author

Shinichi Endo

Observed name: S. Endo
Institution: Ushio (Japan)
ORCID: 0000-0002-6736-3207
Observed ORCID: 0000-0002-6736-3207
OpenAlex ID: A5088299224
Comparison of vacuum ultraviolet irradiation and oxygen plasma treatment as pretreatment for copper seed layer on cycloolefin polymer
2024 · Akihiro Shimizu, Kazuhiro Fukada, et al. · Japanese Journal of Applied Physics · 16
Improved Adhesion of Direct Copper Seed Layer by Medium-Vacuum Sputtering Using Vacuum Ultraviolet Light
2024 · S. Endo, A. Shimizu, et al. · ECS Journal of Solid State Science and Technology · 11
Evaluation of the High-Frequency Transmission Characteristics of Coplanar Transmission Lines Fabricated on a Copper-Plated Cycloolefin Polymer Using a Direct Sputtering Copper Seed Layer
2025 · Akihiro Shimizu, Kazuhiro Fukada, et al. · IEEE Access · 8
Large Scale Photodesmear for Via Residue Cleaning in High Density Interconnect substrates
2015 · Tomoyuki Habu, Masahito Namai, et al. · IMAPSource Proceedings · 7
Improvement of Coherency of the Panel Level Package by Integrated Dry Process
2016 · Shinichi Endo, Tomoyuki Habu, et al. · IMAPSource Proceedings · 6
Full-Sized Panel Photodesmear for Via Residue Cleaning
2016 · Masahito Namai, Akira Aiba, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 6
New desmear process of organic substrate applications by Photodesmear technology
2017 · Shinichi Endo, Tomoyuki Habu, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 5
Enhanced Adhesion of Direct Sputtered Copper Seed Layer on Cycloolefin Polymer through Vacuum Ultraviolet Irradiation and Oxygen Plasma Treatment
2025 · Akihiro Shimizu, Kazuhiro Fukada, et al. · ECS Journal of Solid State Science and Technology · 4
Analysis of the adhesion structure between the cycloolefin polymer and the copper seed layer formed using medium-vacuum sputtering
2025 · Akihiro Shimizu, Kazuhiro Fukada, et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 4
Effect of Hydroxyl Group Concentration Generated by Vacuum Ultraviolet Light on the Adhesion Between Epoxy Resin and Copper
2024 · Shinichi Endo, Yuki Ishikawa, et al. · Journal of Electronic Materials · 4
Differences in the Modification Effect in the Depth Direction on the Surface of Epoxy Resin Irradiated with Vacuum Ultraviolet Light
2024 · Shinichi Endo, Yuki Ishikawa, et al. · Journal of Electronic Materials · 3
Study of Color Change Characteristics of Plasma Indicators by Vacuum Ultraviolet Light from Excimer Lamps
2023 · Akihiro Shimizu, Shinichi Endo, et al. · Transactions of The Japan Institute of Electronics Packaging · 3
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Result of Highly Accelerated Stress Test of Organic Substrate Made by Integrated Dry Process
2020 · Shinichi Endo, Tomoyuki Habu, et al. · Transactions of The Japan Institute of Electronics Packaging · 3
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Comprehensive Analysis of the Impact of Various Surface Modification Techniques on Difficult-to-Adhesion Resins
2025 · Akihiro Shimizu, Shinichi Endo · IEEE Electronic Components and Technology Conference (ECTC) · 2
A Mild Surface Activation Under Redox Gases Using Vacuum Ultraviolet Irradiation for Interconnection of Semiconductor Packaging
2025 · Shinichi Endo, Akihiro Shimizu · IEEE Electronic Components and Technology Conference (ECTC) · 2
Activation of Copper Surfaces by VUV - Redox Method Using a Xenon Excimer Lamp
2024 · Shinichi Endo, Akihiro Shimizu · IEEE International D Systems Integration Conference · 2
Quantitative assessment of surface degradation in cycloolefin polymer films subjected to vacuum ultraviolet irradiation and oxygen plasma treatment using a micro slurry-jet erosion test
2025 · Akihiro Shimizu, Tohru Matsubara, et al. · Journal of Adhesion Science and Technology · 1
Optimization of gas-flow condition for a real scale semiconductor packaging process using the Photodesmear® method
2022 · Shinichi Endo · Japanese Journal of Applied Physics · 1
Reliability Test of Organic Substrate Processed by Newly Desmear Method "PhotodesmearTM"
2018 · Shinichi Endo, Tomoyuki Habu, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 1
An Evaluation of Hybrid Bonding of Cu/SiO 2 using Vacuum Ultraviolet Light under Redox Gases
2026 · Shinichi Endo, Wu Kejun, et al. · IEEE Electronic Components and Technology Conference (ECTC)
Room-temperature Reduction of Molybdenum Oxide via 172-nm Vacuum Ultraviolet Irradiation in an H 2 /N 2 Atmosphere with H 2 O Vapor
2026 · Akihiro Shimizu, Shinichi Endo · IEEE Electronic Components and Technology Conference (ECTC)
Atmospheric Pressure Plasma Treatment for Direct Sputtering of Copper Seed Layers on Cycloolefin Polymer Films for High‐Frequency Applications
2026 · Akihiro Shimizu, Shinichi Endo, et al. · Plasma Processes and Polymers
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A Mild Surface Activation using Vacuum Ultraviolet Irradiation under Redox Gases for Semiconductor Bonding Materials
2025 · S. Endo, A. Shimizu · International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
Comparison of High-Frequency Transmission Characteristics of Transmission Lines on Copper-Plated Cycloolefin Polymer Using Directly Sputtered Copper Seed Layer and Electroless Copper Plating Seed Layer
2025 · Akihiro Shimizu, Kazuhiro Fukada, et al. · IMAPSource Proceedings
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Direct Sputtered Copper Seed Layer Formation on Low Dielectric Resin to Reduce Transmission Loss
2024 · Akihiro Shimizu, Kazuhiro Fukada, et al. · IEEE International D Systems Integration Conference
Works count: 31
Citation count: 89
H-index: 6
I10-index: 2
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