Work

Large Scale Photodesmear for Via Residue Cleaning in High Density Interconnect substrates

Year: 2015

Type: conference-paper

Source: IMAPSource Proceedings

DOI: 10.4071/isom-2015-wp46

Authors: Tomoyuki Habu, Masahito Namai, Akira Aiba, Hajime Kikuiri, Shun Maruyama, Hiroki Horibe, Hiroko Suzuki, Shinichi Endo, Toru Fujinami, Shintaro Yabu, Rahul Jain, Kristof Darmawikarta, Michael Obrien

Institutions: Ushio (Japan), Intel (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2191273091

FWCI: 2.079

Cites: 2

Cited by: 7

Related to: 10