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Bernhard Rebhan

Observed names: B. Rebhan, Rebhan, B., Rebhan, Bernhard
ORCID: 0000-0001-7080-7000
Observed ORCID: 0000-0001-7080-7000
OpenAlex ID: A5090054613
Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors
2016 · S. Lhostis, A. Farcy, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 104
Physical mechanisms of copper-copper wafer bonding
2015 · B. Rebhan, K. Hingerl · Journal of Applied Physics · 88
Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: A critical comparison of 2D and 3D modeling approach
2018 · Thomas Wlanis, René Hammer, et al. · Microelectronics Reliability · 37
Low-Temperature Cu-Cu Wafer Bonding
2013 · Bernhard Rebhan, Günter Hesser, et al. · ECS Transactions · 36
200 nm Wafer-to-wafer overlay accuracy in wafer level Cu/SiO2 hybrid bonding for BSI CIS
2015 · B. Rebhan, M. Bernauer, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 24
Analytical methods used for low temperature Cu–Cu wafer bonding process evaluation
2015 · B. Rebhan, S. Tollabimazraehno, et al. · Microsystem Technologies · 21
Low-Temperature Aluminum-Aluminum Wafer Bonding
2016 · Bernhard Rebhan, Andreas Hinterreiter, et al. · ECS Transactions · 17
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Cu-Cu wafer bonding: An enabling technology for three-dimensional integration
2014 · B. Rebhan, T. Plach, et al. · International Conference on Electronics Packaging (ICEP) · 16
A thermodynamic study of voiding phenomena in Cu–Cu thermo-compression wafer bonding
2017 · B. Rebhan, J. Svoboda, et al. · Microsystem Technologies · 15
High Precision Low Temperature Direct Wafer Bonding Technology for Wafer-Level 3D ICs Manufacturing
2016 · Florian Kurz, Thomas Plach, et al. · ECS Transactions · 14
Optimization of a BEOL Aluminum Deposition Process Enabling Wafer Level Al-Al Thermo-Compression Bonding
2019 · Sebastian Schulze, Matthias Wietstruck, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 13
Al-Al Direct Bonding with Sub-µm Alignment Accuracy for Millimeter Wave SiGe BiCMOS Wafer Level Packaging and Heterogeneous Integration
2019 · Matthias Wietstruck, Sebastian Schulze, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 12
Surface pretreated low-temperature aluminum–aluminum wafer bonding
2017 · Andreas P. Hinterreiter, Bernhard Rebhan, et al. · Microsystem Technologies · 12
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Impact Factors on Low Temperature Cu-Cu Wafer Bonding
2014 · Bernhard Rebhan, Markus Wimplinger, et al. · ECS Transactions · 9
(Invited) High Accuracy Aligned Wafer Bonding for Wafer-Level Integration
2018 · Thomas Plach, Bernhard Rebhan, et al. · ECS Transactions · 7
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Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration
2023 · Tobias Wernicke, Bernhard Rebhan, et al. · ECS Transactions · 5
3D integration by wafer-level aligned wafer bonding
2015 · V. Dragoi, J. Burggraf, et al. · CAS proceedings · 5
Review—Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration
2024 · T. Wernicke, B. Rebhan, et al. · ECS Journal of Solid State Science and Technology · 4
Oxide-Free SiC-SiC Direct Wafer Bonding and Its Characterization
2023 · Péter Kerepesi, Bernhard Rebhan, et al. · ECS Transactions · 4
200 mm Ge Wafer Production for Oxide-Free Si-Ge Direct Wafer Bonding
2020 · Bernhard Rebhan, Johannes Vanpaemel, et al. · ECS Transactions · 4
Direct Wafer Bonding Methods: A Practical Process Selection Guide
2020 · Viorel Dragoi, Bernhard Rebhan, et al. · ECS Transactions · 4
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Oxide Removal for Low-Temperature Metal Thermo-Compression Wafer Bonding
2019 · B. Rebhan, V. Dragoi · International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) · 3
Innovative metal thermo-compression wafer bonding for microelectronics and MEMS devices
2017 · B. Rebhan, V. Dragoi · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3
Low temperature wafer bonding for wafer-level 3D integration
2014 · V. Dragoi, B. Rebhan, et al. · International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) · 3
Metal wafer bonding for 3D interconnects and advanced packaging
2012 · V. Dragoi, E. Pabo, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 3
Works count: 45
Citation count: 470
H-index: 12
I10-index: 13
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