Author

Xi Niu

Institution: Chongqing Vocational College of Public Transportation

Observed institutions: Chongqing Vocational College of Public Transportation, National Cheng Kung University

ORCID: 0000-0001-6042-5957

Observed ORCID: 0000-0001-6042-5957

OpenAlex ID: A5090364702

The microstructure and mechanical properties of Zn-25Sn-XAl (X=0–0.09wt%) high temperature lead free solder

2016 · Xi Niu, Kwang-Lung Lin · Materials Science and Engineering A · 23

Investigations of the wetting behaviors of Zn–25Sn, Zn–25Sn–XPr and Zn–25Sn–YAl high temperature lead free solders in air and Ar ambient

2015 · Xi Niu, Kwang-Lung Lin · Journal of Alloys and Compounds · 17

Effects of Al, Pr additions on the wettability and interfacial reaction of Zn–25Sn solder on Cu substrate

2016 · Xi Niu, Kwang-Lung Lin · Journal of Materials Science Materials in Electronics · 12

Research Status and Prospects of MIG and Hybrid Welding of Titanium and Titanium Alloys

2025 · Xi Niu, Rui Zhang, et al. · ce/papers · 2

Formation of znalo whisker/hillock in zn-25sn-0.09al high-temperature lead-free solder

2025 · Xi Niu, Rui Zhang · Journal of Physics Conference Series

Research and Development of Multi-sensory Virtual Reality Simulation Training Equipment for Safety in Railway Maintenance Operations

2024 · Xi Niu · International Conference on Educational Knowledge and Informatization (EKI)

Formation of ZnAlO Whisker/Hillock in Zn-25Sn-0.09Al High Temperature Lead Free Solder

2024 · Xi Niu · SSRN Electronic Journal

The mechanism of Al contents (0–0.09 wt%) on the wettability and interfacial intermetallic compounds growth of Zn-25Sn/Cu

2017 · Xi Niu, Kwang-Lung Lin, et al. · International Conference on Electronic Packaging Technology (ICEPT)

Works count: 9

Citation count: 54

H-index: 3

I10-index: 3