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Author

Tatiana R. Cahue

Institution: Lewis University
Observed institution: Lewis University
ORCID: 0000-0002-2545-9964
Observed ORCID: 0000-0002-2545-9964
OpenAlex ID: A5090785348
Design of “Low Stress” Post-CMP Cleaning Processes for Advanced Technology Nodes
2022 · Kiana A. Cahue, Abigail L. Dudek, et al. · ECS Transactions · 6
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Utilizing an α,β-Unsaturated Dicarboxylic Acid for a Defect Initiated Residue Removal During Cu post-Chemical Mechanical Planarization Cleaning
2022 · Abigail L. Dudek, Kiana A. Cahue, et al. · ECS Journal of Solid State Science and Technology · 2
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(Invited) Design of Reduced Shear Force Cu Cleaning Processes Via α-β-Unsaturated Chemistries for Enhanced BTA Residue Removal
2024 · Adam T. Caridi, Abigail Dudek, et al. · ECS Meeting Abstracts
Stimuli-Responsive CeO2 Removal Via Surface Redox Modulation during Shallow Trench Isolation (STI) Post-Chemical Mechanical Planarization (p-CMP)
2023 · Tatiana R. Cahue, Ryan J. Gentile, et al. · ECS Meeting Abstracts
Design of “Low Stress” Post-CMP Cleaning Processes for Advanced Technology Nodes
2022 · Kiana A. Cahue, Abigail L. Dudek, et al. · ECS Meeting Abstracts
Works count: 5
Citation count: 8
H-index: 2
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