Author

Ronald C. Lasky

Observed names: Lasky, Ronald. C., R C Lasky, R. C. Lasky, R. Lasky, R.C. Lasky, Ron Lasky, Ronald C Lasky, Ronald Lasky

Institution: Dartmouth College

Observed institutions: Dartmouth College, IBM (United States), Cornell University, VivoSight (United Kingdom), Indium Corporation (United States), Universal Instruments (United States)

OpenAlex ID: A5050631284

Principles of Electronic Packaging

1989 · Donald P. Seraphim, Ronald Lasky, et al. · Journal of Electronic Packaging · 355

Case-II diffusion in polymers. I. Transient swelling

1987 · C.-Y. Hui, K.-C. Wu, et al. · Journal of Applied Physics · 181

Case-II diffusion in polymers. II. Steady-state front motion

1987 · C.-Y. Hui, K.-C. Wu, et al. · Journal of Applied Physics · 161

Multiple levers for overcoming the recalcitrance of lignocellulosic biomass

2019 · Evert K. Holwerda, Robert S. Worthen, et al. · Biotechnology for Biofuels · 106

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The initial stages of Case II diffusion at low penetrant activities

1988 · Ronald C. Lasky, Edward J. Kramer, et al. · Polymer · 88

Moisture solubility and diffusion in epoxy and epoxy-glass composites

1984 · L. L. Marsh, R. Lasky, et al. · IBM Journal of Research and Development · 79

Case II diffusion: effect of solvent molecule size

1990 · Thomas P. Gall, Ronald C. Lasky, et al. · Polymer · 73

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Temperature dependence of case II diffusion

1988 · Ronald C Lasky, Edward J Kramer, et al. · Polymer · 44

Weibull Distribution and Analysis: 2019

2020 · Nadia L. Clement, Ronald C. Lasky · Pan Pacific Symposium · 22

Mechanical response and heat buildup in repetitively impacted elastomers

1977 · P. A. Engel, R. C. Lasky · Experimental Mechanics · 8

Autonomous Vehicles Still Decades Away: 2019

2020 · Raaga Kannan, Ronald C. Lasky · Pan Pacific Symposium · 5

Tin Pest: Elusive Threat in Lead-Free Soldering?

2010 · Ronald C. Lasky · Journal of Failure Analysis and Prevention · 5

Analytical coupling model for obliquely polished single-mode fibers

1993 · D.P. Clement, U. Osterberg, et al. · IEEE Photonics Technology Letters · 5

Packaging Assembly Techniques

2002 · Ronald C. Lasky, Adam Singer, et al. · Elsevier eBooks · 4

The Basics of Metal Thermal Interface Materials (TIMs)

2020 · Timothy Jensen, Ronald Lasky · Pan Pacific Symposium · 3

Tin Pest: A Forgotten Issue in Lead-Free Soldering?

2004 · Ronald C. Lasky · SMTA International · 3

Alignment Metrology and Techniques

2002 · Darrin P. Clement, Ronald C. Lasky, et al. · Elsevier eBooks · 3

Chemically Driven Deformation of Polymers

1989 · C.-Y. Hui, K.-C. Wu, et al. · Journal of Electronic Packaging · 3

The Status of Low Temperature Solders

2024 · Ron Lasky, Ian Tevis, et al. · Pan Pacific Symposium · 2

Time and the Twin Paradox

2006 · Ronald C. Lasky · Scientific American Sp · 2

Settleable and airborne particles in industrial environments

2003 · R.G. Bayer, R. Ginsburg, et al. · IEEE Holm Conference on Electrical Contacts (HOLM) · 2

Optoelectronics for Data Communication [Book Reviews]

1996 · R.C. Lasky, U.L. Oesterberg, et al. · IEEE Communications Magazine · 2

Integrated Circuits, Transceiver Modules, and Packaging

1995 · Jerry Radcliffe, Carolyn Paddock, et al. · Elsevier eBooks · 2

Deposition of Molten Eutectic Solder using Jet Printing Techniques

1995 · Michael D. Snyder, Ronald Lasky · MRS Proceedings · 2

Mastering Complexity: A Solder Material Solution to Manage Component Warpage and Uneven Thermal Gradients in Modern Electronics Manufacturing

2025 · Kevin Brennan, Ronald C. Lasky · Pan Pacific Symposium · 1

Works count: 94

Citation count: 1,169

H-index: 9

I10-index: 9