Author

Ling Yang

2023 · Ling Yang, Bangbiao Wu, et al. · Rock Mechanics and Rock Engineering · 36
2012 · Amir Amirkhany, Jason Wei, et al. · IEEE Journal of Solid-State Circuits · 25
2010 · Dan Oh, Hai Lan, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 13
2011 · Dan Oh, Sam Chang, et al. · IEEE International Symposium on Electromagnetic Compatibility · 8
2004 · R. Schmitt, Xuejue Huang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 8
2025 · Tianqi Wang, Yi Xiang, et al. · International Journal for Numerical Methods in Biomedical Engineering · 5
2010 · Ling Yang, Joong-Ho Kim, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 3
2003 · Ching-Chao Huang, D. Secker, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 3
2023 · Liantian Li, Ling Yang · Journal of Computational Methods in Sciences and Engineering · 2
2006 · W.T. Beyene, Ling Yang, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 2
2006 · D. Oh, WooPoung Kim, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 2
2002 · Ling Yang, Ching-Chao Huang, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 1
2024 · Zhiliang Shu, Yanqiao Sun, et al. · Physics and Chemistry of the Earth Parts A/B/C
2008 · Xiaoning Qi, Joong-Ho Kim, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Works count: 24
Citation count: 182
H-index: 8
I10-index: 6
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