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Yaochao Yang

Observed name: Yao-Chao Yang
OpenAlex ID: A5102156924
Design for velocity saturated, short-channel CMOS drivers with simultaneous switching noise and switching time considerations
1996 · Yaochao Yang, J.R. Brews · IEEE Journal of Solid-State Circuits · 25
Design trade-offs for the last stage of an unregulated, long-channel CMOS off-chip driver with simultaneous switching noise and switching time considerations
1996 · Yaochao Yang, J.R. Brews · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 24
Designing a 3-D Printing-Based Channel Emulator With Printable Electromagnetic Materials
2015 · Xiangyang Jiao, Hui He, et al. · IEEE Transactions on Electromagnetic Compatibility · 10
Delay time estimate for "FAST" CMOS drivers with noisy ground reference
2002 · Yaochao Yang, A. Thurairajaratnam, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 7
Crosstalk estimate for CMOS-terminated RLC interconnections
1997 · Yaochao Yang, J.R. Brews · IEEE Transactions on Circuits and Systems I Fundamental Theory and Applications · 7
Designing A 3D printing based channel emulator
2014 · Xiangyang Jiao, Hui He, et al. · IEEE International Symposium on Electromagnetic Compatibility · 6
Implementation of a 18 GHz bandwidth channel emulator using an FIR filter
2014 · Abhishek Patnaik, Atieh Talebzadeh, et al. · IEEE International Symposium on Electromagnetic Compatibility · 6
Guidelines for high-performance electronic package interconnections approach for strong coupling
1996 · Yaochao Yang, J.R. Brews · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 4
Emulation of lossy channels using a low loss microstrip trace with added lossy materials
2014 · Wei Qian, Guanghua Li, et al. · IEEE International Symposium on Electromagnetic Compatibility · 3
Off-chip 400 Mbps signal transmission: noise reduction using non-resonant lengths and other techniques
2002 · H. Blennemann, Yao-Chao Yang, et al. · IEEE Multi-Chip Module Conference · 2
Electro-mechanical structures for channel emulation
2014 · Satyajeet Shinde, Sen Yang, et al. · IEEE International Symposium on Electromagnetic Compatibility · 1
3D via modeling simplification on multilayer mid-planes
2011 · Qian Li, Kathleen L. Melde, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 1
CMOS off-chip driver design with simultaneous switching noise and switching time considerations
2002 · Yaochao Yang, J.R. Brews · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 1
Scaling tradeoffs for CMOS-based VLSI packaging
2002 · Yaochao Yang, J.R. Brews · IEEE Electronic Components and Technology Conference (ECTC) · 1
* es for High-Perfo ance Electronic Package
1996 · Yaochao Yang, J.R. Brews
erformance Ele erconnections-A Si roae
1996 · Yaochao Yang, J.R. Brews
Design Algorithm for Leadframe Packages with or without Ground Plane
1996 · Chender Huahg, Yaochao Yang, et al.
Design tradeoffs for noise control in signal integrity for MOS-based interconnect systems.
1995 · Yaochao Yang · UA Campus Repository (The University of Arizona)
Works count: 18
Citation count: 98
H-index: 6
I10-index: 3
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