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Author

Cheng-Yu Ho

ORCID: 0009-0008-3092-1624
Observed ORCID: 0009-0008-3092-1624
OpenAlex ID: A5102274278
A 77GHz Antenna-in-Package with Low-Cost Solution for Automotive Radar Applications
2018 · Cheng-Yu Ho, Sheng-Chi Hsieh, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 32
Advanced Thin-Profile Fan-Out with Beamforming Verification for 5G Wideband Antenna
2019 · Ricky Hsieh, Fu-Cheng Chu, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 21
Integrated Antenna-in-Package on Low-Cost Organic Substrate for Millimeter-Wave Wireless Communication Applications
2017 · Cheng-Yu Ho, Ming-Fong Jhong, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 21
A Low-Cost Antenna-in-Package Solution for 77GHz Automotive Radar Applications
2019 · Cheng-Yu Ho, Sheng-Chi Hsieh, et al. · International Conference on Electronics Packaging (ICEP) · 17
mmWave AiP Measurement Turnkey Solution in Millimeter-Wave Wireless Communication Applications
2020 · Sheng-Chi Hsieh, Fu-Cheng Chu, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 16
Electrical modeling of quad flat no-lead packages for high-frequency IC applications
2004 · Yeong-Lin Lai, Cheng-Yu Ho · IEEE Region 10 Conference (TENCON) · 14
mmWave Antenna Design in Advanced Fan-Out Technology for 5G Application
2019 · Sheng-Chi Hsieh, Fu-Chen. Chu, et al. · European Microelectronics and Packaging Conference · 13
Dielectric Characterization of Ultra-Thin Low-Loss Build-Up Substrate for System-in-Package (SiP) Modules
2015 · Cheng-Yu Ho, Hung-Hsiang Cheng, et al. · IEEE Transactions on Microwave Theory and Techniques · 12
Low interconnection loss and low-cost approach for Antenna in Package of 77GHz Automotive Radar applications
2018 · Cheng-Yu Ho, Chen-Chao Wang, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 7
Antenna array integrated on multilayer organic package for millimeter-wave applications
2016 · Cheng-Yu Ho, Ming-Fong Jhong, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 7
Advance semiconductor package applied on high efficiency dual-mode DC-DC buck converter
2015 · Cheng-Yu Ho, Hung-Hsiang Cheng, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 7
Estimating the Reduction of Radiated Emissions From Microstrip Components Using Network Analyzer With a Bulk Current Injection Probe
2013 · Cheng-Yu Ho, Kai-Syaun Chen, et al. · IEEE Microwave and Wireless Components Letters · 7
Performance Analysis and Impact of Manufacturing Tolerances of multi-layers package substrate for 5G mmWave Antenna in Package/Module (AiP/AiM)
2022 · Cheng-Yu Ho, Sheng -Chi Hsieh, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 6
A 2x2 Broadband Dual-Polarized Antenna Array using AiP Techniques for 5G mmWave Beamforming Systems
2022 · Wen-Chun Hsiao, Hong-Sheng Huang, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 6
Corner Analysis of Manufacturing Tolerances of 5G mmWave Antenna in Package/Module (AiP/ AiM)
2021 · Chia-Ching Chu, Cheng-Yu Ho, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 5
Analysis and Optimization of a Multilayer Organic Substrate for mmWave Antenna in Package/Module Application
2021 · Hong-Sheng Huang, Cheng-Yu Ho, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 4
Millimeter-wave antenna in package on low-cost organic substrate for flip chip chip scale (FCCSP) package
2017 · Cheng-Yu Ho, Sheng-Chi Hsieh, et al. · IEEE CPMT Symposium Japan (ICSJ) · 4
Antenna-on-package on low-cost organic substrate for 60 GHz wireless communication applications
2017 · Cheng-Yu Ho, Ming-Fong Jhong, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 4
Design and Optimization of Test Socket for Millimeter-Wave Steerable Beam Measurement Technology
2023 · Yu-Chang Hsieh, Wen-Chun Hsiao, et al. · IEEE CPMT Symposium Japan (ICSJ) · 3
Design of Dual-Band (28/39GHz) Antenna-in-Package with broad bandwidth for 5G Millimeter-Wave Application
2022 · Sheng-Chi Hsieh, Hong-Sheng Huang, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 3
Performance Analysis and Test Solution with Integrated Antenna-in-Package for Millimeter-Wave System
2020 · Sheng-Chi Hsieh, Cheng-Yu Ho, et al. · Electronic System-Integration Technology Conference (ESTC) · 3
High-Frequency Modeling of Quad Flat No-Lead Packages
2006 · Yeong-Lin Lai, Cheng-Yu Ho · International Semiconductor Device Research Symposium · 3
A Compact AiP with a Dual-Polarized 1x4 Antenna Array for 5G Smartphone Applications
2024 · Sheng-Chi Hsieh, Hong-Sheng Huang, et al. · International Conference on Electronics Packaging (ICEP) · 2
Scalable Modeling and Measurement of TSV Applied for Efficiency Improvement of a RF PA
2016 · Ming-Fong Jhong, Cheng-Yu Ho, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
High bandwidth application on 2.5D IC silicon interposer
2014 · Chen-Chao Wang, Hung-Hsiang Cheng, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
Works count: 43
Citation count: 232
H-index: 8
I10-index: 8
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