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Fu-Chen Chu
Observed names:
Fu Chen Chu,
Fu-Chen. Chu
Institution:
Advanced Semiconductor Engineering (Taiwan)
Observed institutions:
National Sun Yat-sen University,
Advanced Semiconductor Engineering (Taiwan)
OpenAlex ID:
A5102541621
mmWave Antenna Design in Advanced Fan-Out Technology for 5G Application
2019
·
Sheng-Chi Hsieh
, Fu-Chen. Chu
, et al.
·
European Microelectronics and Packaging Conference
·
13
Creative Design and Structure Applied to Chiplets Packaging
2023
·
Chen-Chao Wang
, Chih-Yi Huang
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
7
Shielding effectiveness modeling and measurement of multiple layers conformal shielding on system-in-package (SiP) module
2016
·
Chih-Wen Kuo
, Hung-Chun Kuo
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
6
High impedance design and investigation using TDR for fine lines on high density organic substrate
2017
·
Hung-Chun Kuo
, Fu-Chen Chu
, et al.
·
International Conference on Electronics Packaging (ICEP)
·
5
Lowering coupling noise between chips in System-in-Package (SiP) module using compartment shielding
2016
·
Fu-Chen Chu
, Hung-Chun Kuo
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
3
Simulation and Measurement Work for 28GHz AiP Design of 5G Communication Application
2021
·
Fu-Chen Chu
, Sheng-Chi Hsieh
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
2
Utilizing plating bar structure to enhance passive equalizer compensation technique
2014
·
Chen-Chao Wang
, Hung-Chun Kuo
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
·
2
High Speed D2D Interface Applied on Advanced Package
2024
·
Chen Chao Wang
, Chih Yi Huang
, et al.
·
International Conference on Electronics Packaging (ICEP)
·
1
On-Package Decoupling Capacitor Performance Improvement of Flip-Chip Packages for High Power Application
2018
·
Hung-Chun Kuo
, Chih-Wen Kuo
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
1
Multi-physics Design Methodology for Enlarged Chiplets Interconnections in Advanced Packaging
2026
·
Yung-Sheng Lin
, Chih-Yi Huang
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
Advanced Package Solution Applied on High Performance Computing for Heterogeneous Integration
2025
·
Chen Chao Wang
, Chih Yi Huang
, et al.
·
International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
Accurate Modeling Method of LGA Package for High Power Application
2018
·
Cheng-Yu Tsai
, Hung-Chun Kuo
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
Design Optimization of High Density Fine Line Substrate Package Using Bandwidth Analysis
2018
·
Hung-Chun Kuo
, Chih-Wen Kuo
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
Validation of material electrical properties between the true package and ideal modeling
2015
·
Chun-Chieh Lin
, Fu-Chen Chu
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
Utilizing plating bar structure to enhance passive equalizer compensation technique
2014
·
Chen-Chao Wang
, Hung-Chun Kuo
, et al.
·
IEEE International Symposium on Applications of Ferroelectrics (ISAF)
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Works count:
15
Citation count:
40
H-index:
4
I10-index:
1
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