Author

Janet Hopkins

Observed institutions: SPTS Technologies (United Kingdom), KLA (United States)

ORCID: 0009-0006-1627-9650

Observed ORCID: 0009-0006-1627-9650

OpenAlex ID: A5103213637

Characterization of Extreme Si Thinning Process for Wafer-to-Wafer Stacking

2016 · Fumihiro Inoue, Anne Jourdain, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 26

Developments in Si and SiO 2 etching for MEMS-based optical applications

2004 · Lee A. Donohue, Janet Hopkins, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 22

Extreme wafer thinning optimization for via-last applications

2016 · Anne Jourdain, Joeri De Vos, et al. · IEEE International D Systems Integration Conference · 19

RIE dynamics for extreme wafer thinning applications

2018 · Nouredine Rassoul, Anne Jourdain, et al. · Microelectronic Engineering · 17

Etching 200-mm diameter SCALPEL masks with the ASE process

2000 · Ian R. Johnston, Huma Ashraf, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 10

Dicing Tape Performance in a Plasma Dicing Environment

2018 · Stewart Fulton, Oliver Ansell, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 7

Performance enhancement and evaluation of deep dry etching on a production cluster platform

2003 · Mark E. McNie, Christopher Pickering, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 6

A Dry Etch Approach To Reduce Roughness and Eliminate Visible Grind Marks in Silicon Wafers Post Back-Grind

2023 · Roland Mumford, Janet Hopkins, et al. · IEEE Transactions on Semiconductor Manufacturing · 4

Improved Semiconductor Device Reliability from Plasma Dicing

2019 · R. Barnett, Janet Hopkins, et al. · International Wafer Level Packaging Conference (IWLPC) · 3

Novel end-point solution for improvement in die strength and yields with plasma dicing after grind in volume production

2017 · Richard Barnett, Oliver Ansell, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 3

(Invited) Deep Silicon Etching - Increasingly Relevant >20 Years on!

2016 · Dave Thomas, Matthew Muggeridge, et al. · ECS Transactions · 3

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Impact of backside processing on C-V characteristics of TSV capacitors in 3D stacked IC process flows

2015 · Joeri De Vos, Michele Stucchi, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 3

Hybrid Additive and Microfabrication of an Advanced Micromirror Array

2015 · Robert M. Panas, Janet Hopkins, et al. · OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) · 3

Characterization of a UV-USP Laser Grooving Process Combined with Plasma Dicing to Support Next Generation Advanced Packaging Trends

2024 · Rogier Evertsen, Janet Hopkins, et al. · IMAPSource Proceedings · 2

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A Study of Integrated Circuit Dicing Tape When Used in a Plasma Dicing Environment

2020 · Harry Fulton, Oliver Ansell, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2

DRIE, an Enabling Technology for High Density Packaging

2007 · Leslie Lea, Lilian Barker, et al. · International Symposium on High Density packaging and Microsystem Integration · 2

Plasma Dicing Innovations on Film Frame Carriers for High-Bandwidth Memory (HBM) and Heterogeneous Integration Devices

2026 · Simon Dawson, Janet Hopkins, et al. · IMAPSource Proceedings

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Analysis and Management of the Effects of Fluorinated Gases during Plasma Dicing

2024 · Janet Hopkins, David Parker, et al. · IMAPSource Proceedings

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Improved Semiconductor Device Reliability from Plasma Dicing

2019 · R. Barnett, Janet Hopkins, et al. · Wafer-Level Packaging Symposium

Dicing Tape Performance in a Plasma Dicing Environment

2019 · Stewart Fulton, Oliver Ansell, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)

(Invited) Deep Silicon Etching Increasingly Relevant >20 Years on!

2016 · Dave Thomas, Matthew Muggeridge, et al. · ECS Meeting Abstracts

Comparison Between Wet and Dry Silicon Via Reveal in 3D Backside Processing

2015 · Dave Thomas, Janet Hopkins, et al. · Wafer-Level Packaging Symposium

Plasma treatment of polysulfone gas separation membranes

1995 · Janet Hopkins · Durham e-Theses (Durham University)

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Works count: 23

Citation count: 132

H-index: 6

I10-index: 5