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Author

Scott Hayes

Observed institution: Motorola (United States)
OpenAlex ID: A5103589290
The Redistributed Chip Package: A Breakthrough for Advanced Packaging
2007 · Beth Keser, Craig Amrine, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 113
Interfacial reaction of eutectic AuSi solder with Si (100) and Si (111) surfaces
2004 · Jin-Wook Jang, Scott Hayes, et al. · Journal of Applied Physics · 32
Implementation of a mobile phone module with redistributed chip packaging
2008 · Lakshmi N. Ramanathan, Beth Keser, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 12
Advanced Packaging: The Redistributed Chip Package
2007 · Beth Keser, Craig Amrine, et al. · IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM) · 5
3D RCP Package Stacking: Side Connect, An Emerging Technology for System Integration and Volumetric Efficiency
2013 · Michael Vincent, Doug Mitchell, et al. · IMAPSource Proceedings · 4
Reliability and Performance Improvements of 3D System-in-Packages in Fan-Out Wafer Level Packaging
2013 · Scott Hayes, Tony Gong, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 1
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3D & System-in-Package Development with the Redistributed Chip Package (RCP)
2012 · Zhiwei (Tony) Gong, Scott Hayes, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
System-in-Package Opportunities with the Redistributed Chip Package (RCP)
2011 · Scott Hayes, Navjot Chhabra, et al. · Wafer-Level Packaging Symposium
Impact of Process Improvements on Reliability of RCP Technology During Scale-up
2011 · George R. Leal, Scott Hayes, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
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TheRedistributed ChipPackage: A Breakthrough forAdvanced Packaging
2007 · Craig Amrine, Scott Hayes, et al.
AdvancedPackaging: TheRedistributed ChipPackage
2007 · Scott Hayes, William Lytle
Works count: 11
Citation count: 167
H-index: 4
I10-index: 3
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