Author

Chao-Hsin Lu

Observed names: C. T. Lu, C.T. Lu

Observed institutions: National Taipei University of Technology, National Central University, MediaTek (Taiwan)

OpenAlex ID: A5103713970

20.2 A 40MHz-BW 320MS/s Passive Noise-Shaping SAR ADC With Passive Signal-Residue Summation in 14nm FinFET

2019 · Ying-Zu Lin, Chin-Yu Lin, et al. · Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference · 108

A 2.4-mW 25-MHz BW 300-MS/s passive noise shaping SAR ADC with noise quantizer technique in 14-nm CMOS

2017 · Ying-Zu Lin, Chih-Hou Tsai, et al. · Symposium on VLSI Circuits · 47

A 8.2-mW 10-b 1.6-GS/s 4× TI SAR ADC with fast reference charge neutralization and background timing-skew calibration in 16-nm CMOS

2016 · Ying-Zu Lin, Chih-Hou Tsai, et al. · Symposium on VLSI Circuits · 46

Design and anaylsis of a 2.5-Gbps optical receiver analog front-end in a 0.35-/spl mu/m digital CMOS technology

2006 · Wei-Zen Chen, Chao-Hsin Lu · IEEE Transactions on Circuits and Systems I Fundamental Theory and Applications · 34

27.5 An 80MHz-BW 640MS/s Time-Interleaved Passive Noise-Shaping SAR ADC in 22nm FDSOI Process

2021 · Chin-Yu Lin, Ying-Zu Lin, et al. · Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference · 33

A 4-in-1 (WiFi/BT/FM/GPS) connectivity SoC with enhanced co-existence performance in 65nm CMOS

2012 · Yuan-Hung Chung, Min Chen, et al. · Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference · 30

Evaluation of the microstructural and photocatalytic properties of aluminum-doped zinc oxide coatings deposited by plasma spraying

2013 · C.Y. Su, C.T. Lu, et al. · Thin Solid Films · 25

A 2.5 Gbps CMOS optical receiver analog front-end

2003 · Wei-Zen Chen, Chao-Hsin Lu · Custom Integrated Circuits Conference · 25

Bandwidth enhancement techniques for transimpedance amplifier in CMOS technologies

2001 · Chao-Hsin Lu, Wei‐Zen Chen · 18

Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces

2009 · H. W. Tseng, C. T. Lu, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 4

Back-Fill Sn Flux against Current-Stressing at Cathode Micro Cu/Sn Interface

2013 · C. Y. Liu, Y. C. Hsu, et al. · ECS Solid State Letters · 2

Effective Charge Number of Cu in Cu-Sn Compound

2012 · C. T. Lu, Y. J. Hu, et al. · ECS Solid State Letters · 2