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Author

Markus Gabriel

Observed name: Gabriel, Markus
OpenAlex ID: A5103763794
Wafer direct bonding with ambient pressure plasma activation
2006 · Markus Gabriel, Brad Johnson, et al. · Microsystem Technologies · 18
Low-Temperature Direct Bonding of Borosilicate, Fused Silica, and Functional Coatings
2010 · Marko Eichler, Benedikt Michel, et al. · ECS Transactions · 17
W2W permanent stacking for 3D system integration
2014 · Lan Peng, Soon-Wook Kim, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 16
Detection of Interfacial Gas Bubbles in Wafer Bonded Silicon with Different Surface Treatments
2008 · Gavin Horn, Markus Gabriel, et al. · Journal of The Electrochemical Society · 12
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Process characterization of thin wafer debonding with thermoplastic materials
2012 · Alain Phommahaxay, Anne Jourdain, et al. · Electronic System-Integration Technology Conference (ESTC) · 9
Equipment challenges and solutions for diverse temporary bonding and de-bonding processes in 3D integration
2010 · Markus Gabriel, Thomas Knauer Peter Bisson, et al. · IEEE International D Systems Integration Conference · 6
(Invited) Plasma Activation as a Pretreatment Tool for Low-Temperature Direct Wafer Bonding in Microsystems Technology
2013 · Marko Eichler, Philipp Hennecke, et al. · ECS Transactions · 4
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Low-Temperature Direct Bonding of Borosilicate, Fused Silica, and Functional Coatings
2010 · Marko Eichler, Benedikt Michel, et al. · ECS Meeting Abstracts · 3
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Atmospheric Plasma Conditions Compatible with Wafer to Wafer Bonding Strategies
2006 · Shari N. Farrens, Markus Gabriel · ECS Transactions · 2
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Capabilities of an Ambient Pressure Plasma for Activation in LT Wafer Bonding Processes
2006 · Markus Gabriel, Sven Hansen, et al. · ECS Meeting Abstracts · 2
Einsatz von Mikroplasmen für die Herstellung von Silizium‐Mehrlagenaufbauten
2009 · Marko Eichler, Benedikt Michel, et al. · Vakuum in Forschung und Praxis · 1
Introduction of a unified equipment platform for UV initiated processes in conjunction with the application of electrostatic carriers as thin wafer handling solution
2009 · D. Tönnies, Markus Gabriel, et al. · European Microelectronics and Packaging Conference · 1
Plasma Activation as a Pretreatment Tool for Low-Temperature Direct Wafer Bonding Materials in Microsystems Technology
2012 · Marko Eichler, Philipp Hennecke, et al. · ECS Meeting Abstracts
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Anodic and Direct Bonding of Si and Glass - Similarities and Distinctions in Applications
2006 · Markus Gabriel, Volkan Cetin, et al. · ECS Transactions
Atmospheric Plasma Conditions Compatible with Wafer to Wafer Bonding Strategies
2006 · Shari N. Farrens, Markus Gabriel · ECS Meeting Abstracts
PDF
Anodic and Direct Bonding of Si and Glass - Similarities and Distinctions in Applications
2006 · Markus Gabriel, Volkan Cetin, et al. · ECS Meeting Abstracts
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Low-temperature Wafer Bonding via DBD Surface Activation
2006 · Ionut Radu, Manfred Reiche, et al. · ECS Meeting Abstracts
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Mechanisms of Low-Temperature Wafer Bonding
2006 · Manfred Reiche, Ionut Radu, et al. · ECS Meeting Abstracts
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Works count: 20
Citation count: 91
H-index: 6
I10-index: 4
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