Author

Daowei Wu

Observed names: D. L. Wu, D.L. Wu, Dao-wei Wu

Observed institutions: Xidian University, Beijing Institute of Spacecraft Environment Engineering

OpenAlex ID: A5104009626

Three-cell model and 5D braided structural composites

1996 · D.L. Wu · Composites Science and Technology · 97

Dual‐Graded Microstructure Engineering for Flexible Piezoresistive Sensors with High Sensitivity and Broad Linear Range in Physiological Monitoring

2025 · Ningning Bai, Dandan Xu, et al. · Advanced Science · 49

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An RDL Modeling and Thermo-Mechanical Simulation Method of 2.5D/3D Advanced Package Considering the Layout Impact Based on Machine Learning

2023 · Xiaodong Wu, Zhizhen Wang, et al. · Micromachines · 23

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Research of Wafer Level Bonding Process Based on Cu–Sn Eutectic

2020 · Daowei Wu, Wenchao Tian, et al. · Micromachines · 17

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A Hybrid Method for the Online Evaluation of Stress Fields in Metal Additive Manufacturing

2021 · G. Z. Zeng, R. L. Zu, et al. · Experimental Mechanics · 14

Application of genetic algorithm in M × N reconfigurable antenna array based on RF MEMS switches

2018 · Wenchao Tian, Daowei Wu, et al. · Modern Physics Letters B · 14

A Simplified Method for Analyzing PCB Warpage During Reflow: Focusing on Warpage Change and Initial Warpage Shape

2025 · Zhenyang Lei, Jinyong Li, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 8

Modeling and Simulation for Predicting Thermo-Mechanical Behavior of Wafer-Level Cu-PI RDLs During Manufacturing

2025 · Xianglong Chu, Shitao Wang, et al. · Micromachines · 8

Analytical equivalent circuit modeling and analysis of complex BGA for 3D silicon-interposer packaging

2023 · Lei Tang, Kangrong Li, et al. · Microelectronics Journal · 7

Thermal performance optimization of dual-bridge arm SiC IGBT modules via microstructure-modified microchannel heat sinks under double-sided liquid cooling

2026 · Hanyang Xu, Yifan Wang, et al. · International Communications in Heat and Mass Transfer · 4

Effects of polycrystalline AlN layer on the crystalline quality of AlxGa1-xN buffer layer and optimization of growth processes: A molecular dynamics study

2025 · Yunfei Song, Rui Li, et al. · Materials Science in Semiconductor Processing · 4

Predicting effective thermal conductivity of sintered nano-Ag with artificial neural networks

2025 · Libo Zhao, Jiahui Wei, et al. · International Journal of AI for Materials and Design · 3

LC Virtual Separation Method: An Accurate Modelling Approach for Equivalent Circuit Models of Complex TSV Structures

2024 · Haoyu Niu, Daowei Wu, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 3

Research on deep trench capacitor structure design and its effect on capacitance density and breakdown voltage

2024 · Pengsen Wang, Zhenyang Lei, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 3

Warpage Simulation and Analysis of 6-Inch Wafers in the Damascene Process

2025 · Hutao Shi, Gai Wu, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 1

Stress Analysis of Cu/Sn Bump Eutectic Bonding Interface

2021 · Xinpeng Chen, Ruixia Huo, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 1

Opening the hole of the backside silicon and forming the alloy bump for TSVs

2015 · Dao-wei Wu, Ke-Zhong Li, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 1

Copper filling by electroplating for high aspect ratio TSV

2013 · Yongfu Liu, Daowei Wu · International Conference on Electronic Packaging Technology (ICEPT) · 1

An investigation on diffusion bonding of Cu-Cu via different metal interlayer: MD calculations

2026 · Chunmin Cheng, Xiang Sun, et al. · Surfaces and Interfaces

Effect of dual annealing process on stress-strain relations of through silicon vias-copper

2025 · Zhuohao Zhang, Fei Qin, et al. · International Conference on Electronic Packaging Technology (ICEPT)

Determination of fracture toughness and CZM parameters of interfaces for three-dimensional multilayered package on package

2025 · Xingyu Liu, Yanwei Dai, et al. · International Conference on Electronic Packaging Technology (ICEPT)

Evolution mechanism of interconnect interface and shear properties of 64.8Sn35.2Pb microbump during flip chip bonding

2025 · Yu-lu Shen, Jiao Luo, et al. · Journal of Central South University

Research on 3D interposer/chip stacking technology and reliability

2021 · Ning Zhang, Baoxia Li, et al. · International Conference on Electronic Packaging Technology (ICEPT)

Works count: 23

Citation count: 258

H-index: 8

I10-index: 6