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Laurent Mendizabal

Characterization of unintentional doping in localized epitaxial GaN layers on Si wafers by scanning spreading resistance microscopy
2023 · Thomas Kaltsounis, Helge Haas, et al. · Microelectronic Engineering · 16
From epitaxy to converters topologies what issues for 200 mm GaN/Si?
2015 · L. Di Cioccio, E. Morvan, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 14
An improved accelerated degradation model for LED reliability assessment with self-heating impacts
2021 · Minh-Tuan Truong, Phuc Do, et al. · Microelectronics Reliability · 13
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Improved Low Temperature Sinter Bonding Using Silver Nanocube Superlattices
2022 · Maxime Bronchy, Lucien Roach, et al. · The Journal of Physical Chemistry C · 11
High breakdown voltages on pseudo-vertical p–n diodes by selective area growth of GaN on silicon
2024 · Thomas Kaltsounis, Mohammed El Amrani, et al. · Journal of Applied Physics · 6
Design of a GaN HEMT based inverter leg power module for aeronautic applications
2016 · Benoit Thollin, Fadi Zaki, et al. · Electronic System-Integration Technology Conference (ESTC) · 4
Modular and versatile characterization test bench for optical phased arrays
2022 · Jean B. Hue, Vincent Moulin, et al. · Photonic Instrumentation Engineering · 3
A novel degradation model for LED reliability assessment with accelerated stress and self-heating consideration
2021 · Minh-Tuan Truong, Laurent Mendizabal, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
Low-temperature silver sintering by colloidal approach
2020 · Maxime Bronchy, Jean-Charles Souriau, et al. · Electronic System-Integration Technology Conference (ESTC) · 2
Innovative process development for LEDs dome shaping without molding
2016 · Abdenacer Ait Mani, Gaid Moulin, et al. · Electronic System-Integration Technology Conference (ESTC) · 2
A 3.19pJ/b Electro-Optical Router with 18ns Setup Frame-Level Routing and 1-to-6 Wavelength-Flexible Link Capacity for Photonic Interposers
2026 · Yvain Thonnart, Christian Bernard, et al. · Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference · 1
Towards 3D Integration of GaN-on-Si MicroLED and MicroPD Arrays with an Energy-Efficient 22nm FDSOI Transceiver for Short-Range Parallel Optical Communication
2025 · Patrick Le Maitre, Anthony Cibié, et al. · Proceedings of the International Display Workshops · 1
Localized Epitaxial Growth of 402 V Breakdown Voltage Quasi‐Vertical GaN‐on‐Si p‐n Diode on 200 mm‐Diameter Wafers
2024 · Thomas Kaltsounis, Mohammed El Amrani, et al. · physica status solidi (a) · 1
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An upgradable testing platform designed to characterize and test optical components of FMCW LiDARs, particularly optical phased arrays
2023 · Jean B. Hue, Vincent Moulin, et al. · Photonic Instrumentation Engineering · 1
A Bayesian-based optimization approach for accelerated degradation test plan of a LED component with self-heating impact
2022 · Minh-Tuan Truong, Phuc Do, et al. · International Conference on Systems and Control (ICSC) · 1
Reliability of Laser Diodes for High-rate Optical Communications – A Monte Carlo-based Method to Predict Lifetime Distributions and Failure Rates in Operating Conditions
2021 · Laurent Mendizabal, Frédéric Verdier, et al. · Elsevier eBooks · 1
Optimization of a metalens-based fiber-to-chip coupler for efficient and broadband coupling
2026 · Maori Cabanes, Christophe Sauvan, et al. · Integrated Photonics Platforms
Efficient and broadband metalens based coupling architecture for silicon photonics chips
2026 · Maori Cabanes, Christophe Sauvan, et al. · Optics Express
Pressure-less silver sintering on pure copper: impact of thermal cycling on microstructure and mechanical strength
2026 · Céline Feautrier, Laurent Mendizabal, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology
Development and Characterizations of Fine Pitch Flip-Chip Interconnection Using Silver Sintering
2024 · Julie Gougeon, Jean-Charles Souriau, et al. · IMAPSource Proceedings
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Development and Characterizations of Fine Pitch Flip-Chip Interconnection Using Silver Sintering
2023 · Julie Gougeon, Céline Feautrier, et al. · European Microelectronics and Packaging Conference
Développement et caractérisation d’un nouveau procédé d’interconnexion pour l’électronique par frittage de nanoparticules
2022 · Gougeon, Julie, Souriau, Jean-Charles, et al. · HAL
List of Authors
2021 · Laurent Béchou, Daniel T. Cassidy, et al. · Elsevier eBooks
Reliability Assessment of Optoelectronic Systems with Stochastic Interactions under Accelerated Degradation Testing
2019 · Minh-Tuan Truong, Phuc Do, et al. · International Conference on System Reliability and Safety (ICSRS)
Fiabilité de diodes laser DFB 1,55 um pour des applications de télécommnication : approche statistique et interaction composant-système
2006 · Laurent Mendizabal
Works count: 29
Citation count: 79
H-index: 5
I10-index: 4
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