Author

Harry K. Charles

Observed names: Charles H., H. Charles, H. K. Charles, H.K Charles, H.K Charles Jr, H.K. Charles, H.K. Jr. Charles, H.K.Jr. Charles, Harry K. Charles, Jr.

Institution: Johns Hopkins University

Observed institutions: Johns Hopkins University, United States Naval Academy, Johns Hopkins University Applied Physics Laboratory

OpenAlex ID: A5109224046

Multisite microprobes for neural recordings

1991 · N.A. Blum, B.G. Carkhuff, et al. · IEEE Transactions on Biomedical Engineering · 93

Catheter‐tracking FOV MR fluoroscopy

1998 · Ergin Atalar, Dara L. Kraitchman, et al. · Magnetic Resonance in Medicine · 69

Flip Chip Assembly of Thinned Silicon Die on Flex Substrates

2008 · Charles Banda, R. Wayne Johnson, et al. · IEEE Transactions on Electronics Packaging Manufacturing · 63

Gold-Aluminum Intermetallics: Ball Bond Shear Testing and Thin Film Reaction Couples

1984 · G. Clatterbaugh, J. Weiner, et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 61

Steady-state thermal conductivity measurements of AlN and SiC substrate materials

1989 · E.S. Dettmer, B.M. Romenesko, et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 51

Wirebonding at higher ultrasonic frequencies: reliability and process implications

2003 · H.K Charles, K.J Mach, et al. · Microelectronics Reliability · 44

Evaporated polycrystalline silicon films for photovoltaic applications - grain size effects

1978 · Charles Feldman, Norman A. Blum, et al. · Journal of Electronic Materials · 40

Solder Joint Reliability — Design Implications From Finite Element Modeling and Experimental Testing

1990 · H. K. Charles, G. V. Clatterbaugh · Journal of Electronic Packaging · 37

The effect of high-temperature intermetallic growth on ball shear-induced cratering

1990 · G.V. Clatterbaugh, H.K. Charles · IEEE Transactions on Components Hybrids and Manufacturing Technology · 33

Metal Electromigration Induced by Solder Flux Residue in Hybrid Microcircuits

1988 · R.C. Benson, B.M. Romenesko, et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 30

Metal electromigration induced by solder flux residue in hybrid microcircuits

2003 · J.A. Weiner, R.C. Benson, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 23

Advanced Wire Bonding Technology: Materials, Methods, and Testing

2008 · Harry K. Charles · Springer eBooks · 21

Review of amorphous and polycrystalline thin film silicon solar cell performance parameters

1980 · H.K. Charles, A.P. Ariotedjo · Solar Energy · 21

Advanced Wire Bonding Technology: Materials, Methods, and Testing

2016 · Harry K. Charles · Springer eBooks · 18

Switching times in amorphous boron, boron plus carbon, and silicon thin films

1975 · Harry K. Charles, Charles Feldman · Journal of Applied Physics · 16

Influence of Tin Deposition Methods on Tin Whisker Formation

2011 · Lesly A. Pinol, John Melngailis, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 15

Electronics and the environment

2004 · H.K. Charles, N. Simadurai · IEEE Electronic Components and Technology Conference (ECTC) · 15

Current-Leakage Failures in Hybrid Microcircuits

1986 · R. Benson, B. Romenesko, et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 14

Optical Deflection Measurement for Characterization of Microelectromechanical Systems (MEMS)

2004 · S.L. Firebaugh, H.K. Charles, et al. · IEEE Transactions on Instrumentation and Measurement · 13

Wirebonding on various multichip module substrates and metallurgies

2002 · H.K. Charles, K.J. Mach, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 13

Surface analysis of adsorbed species from epoxy adhesives used in microelectronics

1985 · R.C. Benson, B.H. Nall, et al. · Applications of Surface Science · 13

Electrical properties of carbon-doped amorphous boron films

1976 · Charles Feldman, Harry K. Charles, et al. · Journal of the Less Common Metals · 11

Wirebonding: reinventing the process for MCMs

2002 · H.K. Jr. Charles, K.J. Mach, et al. · International Conference on Multichip Modules (ICMCM) · 10

The Influence of Contamination on Aluminum-Gold Intermetallics

1982 · H. K. Charles, B. M. Romenesko, et al. · IEEE International Reliability Physics Symposium proceedings · 10

Electrothermal model of switching in amorphous boron and silicon thin films

1974 · Charles Feldman, Harry K. Charles · Solid State Communications · 10

Works count: 91

Citation count: 926

H-index: 15

I10-index: 25