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Jurgen M. Wolf

Observed names: Jurgen Wolf, Jürgen M. Wolf, Jürgen Wolf, Wolf, Jürgen, Wolf, Jürgen M.
OpenAlex ID: A5110320744
3D System Integration Technologies
2003 · Peter Ramm, Armin Klumpp, et al. · MRS Proceedings · 56
Characteristics of fritting contacts utilized for micromachined wafer probe cards
2000 · Toshihiro Itoh, Tadatomo Suga, et al. · Review of Scientific Instruments · 19
Characterization of low temperature Cu/In bonding for fine-pitch interconnects in three-dimensional integration
2017 · Iuliana Panchenko, Steffen Bickel, et al. · Japanese Journal of Applied Physics · 18
Design and Comparison of 24 GHz Patch Antennas on Glass Substrates for Compact Wireless Sensor Nodes
2010 · Florian Ohnimus, Uwe Maaß, et al. · International Journal of Microwave Science and Technology · 16
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The correction factors and their new curve for the measurement of sheet resistance of a square sample with a square four-point probe
1992 · Yicai Sun, Oswin Ehrmann, et al. · Review of Scientific Instruments · 15
Processing of ultrathin 300 mm wafers with carrierless technology
2011 · Sven Spiller, Froilan Molina, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7
Miniaturised Sensor Node for Tire Pressure Monitoring (e-CUBES)
2009 · Kari Schjølberg-Henriksen, Maaike Margrete Visser Taklo, et al. · Springer eBooks · 7
Evaluation of Micro Structured Glass Layers as Dielectric-and Passivation Material for Wafer Level Integrated Thin Film Capacitors and Resistors
2007 · Kai Zoschke, Christian Feige, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7
Novel Cu-nanowire-based technology enabling fine pitch interconnects for 2.5D/3D Integration
2022 · Adil Shehzad, Ran Yin, et al. · Electronic System-Integration Technology Conference (ESTC) · 6
Determination of the areas of a square sample suitable to the resistance measurement by Van der Pauw’s method
1992 · Yicai Sun, Oswin Ehrmann, et al. · Review of Scientific Instruments · 4
Analysis and comparison of methods for extracting the inductance and capacitance of TSVs
2012 · Ivan Ndip, Kai Lobbicke, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 3
Flip Chip Reliability of GaAs on Si Thinfilm Substrates Using AuSn Solder Bumps
2005 · Hermann Oppermann, Matthias Hutter, et al. · MRS Proceedings · 3
Power Microtransformer on Silicon Embedded into PCB
2021 · Dragan Dinulovic, Leon Haase, et al. · International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) · 2
Low temperature Cu/In bonding for 3D integration
2017 · Iuliana Panchenko, Steffen Bickel, et al. · International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) · 2
Innovative solutions for systems based on embedding of thin components into flexible printed circuit boards
2015 · Jürgen Wolf, Muhammad Alshahed, et al. · European Microelectronics and Packaging Conference · 1
Wireless Sensor Systems – The e‐CUBES Project
2008 · Adrian M. Ionescu, Eric Beyne, et al. · 1
Technologies for 3D Heterogeneous Integration
2008 · Wolf, Jürgen, Ramm, P., et al. · arXiv (Cornell University) · 1
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Investigation of Low Temperature Bonding Process based on Cu/Ni/In Solid Liquid Interdiffusion
2024 · Adil Shehzad, Steffen Bickel, et al. · IMAPSource Proceedings
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Inkjet in the PCB ‐Production
2022 · Markus Kennert, Jürgen Wolf
Dual Side Chip Cooling Realized by Microfluidic Interposer Processing on 300mm Wafer Diameter
2017 · Wolfram Steller, Frank Windrich, et al. · Wafer-Level Packaging Symposium
Advanced Integration Technologies - Challenges and Solutions Concerning Cyber-Physical Systems
2015 · Klaus-Dieter Lang, Harald Pötter, et al. · Pan Pacific Symposium
Investigation of UBM Systems for Electroplated Sn/37Pb and Sn/3.5Ag Solder Bumps
2001 · S.-Y. Jang, Jürgen Wolf, et al. · Microsystem Technologies
Works count: 28
Citation count: 168
H-index: 7
I10-index: 5
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