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Fon-Shan Huang

Observed names: Fon-Shan Huang Fon-Shan Huang, Fon-shan Huang, Fonshan Huang, Huang Fon-shan
OpenAlex ID: A5113551330
Low-temperature method for enhancing sputter-deposited HfO2 films with complete oxidization
2007 · Chih-Tsung Tsai, Ting-Chang Chang, et al. · Applied Physics Letters · 36
A low temperature fabrication of HfO2 films with supercritical CO2 fluid treatment
2008 · Chih-Tsung Tsai, Ting-Chang Chang, et al. · Journal of Applied Physics · 27
Thermal stability study of TiN/TiSi2 diffusion barrier between Cu and n+Si
1994 · Tzong-Sheng Chang, Wen-Chun Wang, et al. · Journal of Applied Physics · 23
The Improvement of High-$k$/Metal Gate pMOSFET Performance and Reliability Using Optimized Si Cap/SiGe Channel Structure
2010 · Wen-Kuan Yeh, Yu-Ting Chen, et al. · IEEE Transactions on Device and Materials Reliability · 20
Fabrication and Characterization of a Three-Dimensional Flexible Thermopile
2008 · Puru Lin, Ching-Yi Wu, et al. · Japanese Journal of Applied Physics · 14
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MOCVD Al Nanocrystals Embedded in AlOxNyThin Films for Nonvolatile Memory
2012 · Nian-Huei Chen, Chiu-Yen Wang, et al. · ECS Journal of Solid State Science and Technology · 11
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Surface modification on low dielectric constant material—methylsilsesquioxane
2003 · Chung-Hsien Chen, Fon-Shan Huang · Thin Solid Films · 11
Low temperature improvement on silicon oxide grown by electron-gun evaporation for resistance memory applications
2008 · Chih-Tsung Tsai, Ting-Chang Chang, et al. · Applied Physics Letters · 10
A compact millimeter-wave broadband stacked coupled balun
2012 · Hsuan-Der Yen, Guo-Wei Huang, et al. · Asia-Pacific Microwave Conference (APMC) · 8
Fabrication of a GHz band surface acoustic wave filter by UV-nanoimprint with an HSQ stamp
2011 · Nian-Huei Chen, Ju-Chun Huang, et al. · Journal of Micromechanics and Microengineering · 7
The Impact of Oxide Traps Induced by SOI Thickness on Reliability of Fully Silicide Metal-Gate Strained SOI MOSFET
2010 · Cheng-Li Lin, Yu-Ting Chen, et al. · IEEE Electron Device Letters · 7
Study of tantalum-based diffusion barriers between Al and Si
1994 · Wen-Chun Wang, Tzong-Sheng Chang, et al. · Solid-State Electronics · 7
Nanocontact Printing Using a Hydrogen Silsesquioxane Stamp with Low E-beam Dose
2007 · Ming-Tse Dai, Kai-Yuen Lam, et al. · Journal of The Electrochemical Society · 6
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Oriented wedge-like hillocks on Al-0.5 wt.%Cu/TiN/SiO2/Si multilayer structure
2000 · P Wang, J Hwang, et al. · Thin Solid Films · 6
Effect of $\hbox{NH}_{3}$ Plasma Nitridation on Hot-Carrier Instability and Low-Frequency Noise in Gd-Doped High- $ \kappa$ Dielectric nMOSFETs
2011 · Yu-Ting Chen, Kun-Ming Chen, et al. · IEEE Transactions on Electron Devices · 5
Rapid thermal nitridation of titanium on Cu/Si contact system
1995 · Tzong-Sheng Chang, Wen-Chun Wang, et al. · Solid-State Electronics · 4
Gold nanowires fabricated by immersion plating
2008 · Chih-Chieh Hsu, Fang-Yee Shen, et al. · Nanotechnology · 3
Diffusion barrier study on TaSix and TaSixNy
1993 · Wen-Chun Wang, Tzong-Sheng Chang, et al. · Thin Solid Films · 3
Impact of Highly Compressive Interlayer-Dielectric-$ \hbox{SiN}_{x}$ Stressing Layer on $\hbox{1}/f$ Noise and Reliability of SiGe-Channel pMOSFETs
2010 · Yu-Ting Chen, Kun-Ming Chen, et al. · IEEE Electron Device Letters · 2
Ta-rich tantalum silicide nano-cluster diffusion barrier in ULSI metallization
2002 · Da-Wei Lin, Shih-Chan Huang, et al. · IEEE International Conference on Solid-State and Integrated Circuit Technology · 2
Investigations of Localized States in Hydrogenated Amorphous Silicon
1984 · Fon-Shan Huang, Hua Chang, et al. · Japanese Journal of Applied Physics · 2
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Low-Frequency Noise Characteristics of SiGe p-Channel Metal–Oxide–Semiconductor Field-Effect Transistors with High-Compressive Interlayer-Dielectric-SiNx Stressing Layer
2009 · Yu-Ting Chen, Kun-Ming Chen, et al. · Japanese Journal of Applied Physics · 1
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The Study on Nanocontact Printing with Ink Aminosilane
2006 · K.y. Lam, Leio Chen, et al. · IEEE International Conference on Solid-State and Integrated Circuit Technology · 1
The Leakage Current Conduction Mechanisms of Cu/Porous Silica Damascene Schemes with Nano-cluster TaSix Barrier
2005 · Chung-Hsien Chen, Chin-Piao Chang, et al. · Japanese Journal of Applied Physics · 1
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Erratum: “Quantitative Study of Charge‐to‐Breakdown of Thin Gate Oxide for a p+‐Poly‐Si Metal Oxide Semiconductor Capacitor,” [J. Electrochem. Soc., 144, 698 (1997)]
1997 · Li‐shuenn Wang, Fonshan Huang, et al. · Journal of The Electrochemical Society · 1
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Works count: 34
Citation count: 220
H-index: 8
I10-index: 8
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