Author

Masaki SHIRATORI

Observed names: Masaki Shiratori, Shiratori Masaki, Shiratori, Masaki

Institution: Yokohama National University

Observed institutions: Japan Atomic Energy Agency, Panasonic (Japan), Toshiba (Japan), Central Research Institute of Electric Power Industry, Nippon Steel (Japan), Yokohama National University, Sumitomo Heavy Industries (Japan), University of Oxford, IHI Corporation (Japan), Mitsubishi Electric (Japan), National Research Institute for Earth Science and Disaster Resilience, JFE Steel Corporation (Japan), National Defense Academy of Japan, Hitachi (Japan), The University of Tokyo

OpenAlex ID: A5113596945

Analysis of stress intensity factors for surface cracks subject to arbitrarily distributed surface stresses.

1985 · Masaki SHIRATORI, Toshiro MIYOSHI, et al. · TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A · 81

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Experimental study of low-cycle fatigue of pipe elbows with local wall thinning and life estimation using finite element analysis

2010 · Koji Takahashi, Satoshi Tsunoi, et al. · International Journal of Pressure Vessels and Piping · 48

Analysis of stress intensity factors for surface cracks subjected to arbitrarily distributed surface stresses (2nd report, Analysis and application of influence coefficients for flat plates with a semielliptical surface crack)

1986 · Masaki SHIRATORI, Toshiro MIYOSHI, et al. · TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A · 46

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Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints

2007 · Qiang Yu, Tadahiro Shibutani, et al. · Microelectronics Reliability · 41

Pressure-induced tin whisker formation

2008 · Tadahiro Shibutani, Qiang Yu, et al. · Microelectronics Reliability · 39

Analysis of stress intensity factors for surface cracks subjected to arbitrarily distributed surface stresses. (3rd report Analysis and application of influence coefficients for round bars with a semielliptical surface crack)

1987 · Masaki SHIRATORI, Toshiro MIYOSHI, et al. · TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A · 33

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Stress-Induced Tin Whisker Initiation Under Contact Loading

2006 · Tadahiro Shibutani, Qiang Yu, et al. · IEEE Transactions on Electronics Packaging Manufacturing · 28

A Study of Deformation Mechanism During Nanoindentation Creep in Tin-Based Solder Balls

2006 · Tadahiro Shibutani, Qiang Yu, et al. · Journal of Electronic Packaging · 27

Analysis of Stress Intensity Factor due to Surface Crack Propagation in Residual Stress Fields Caused by Welding

2002 · Katsumasa MIYAZAKI, Masahito MOCHIZUKI, et al. · JSME International Journal Series A · 23

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Thermal fatigue reliability assessment for solder joints of BGA assembly

1999 · Qiang Yu, Masaki SHIRATORI · 22

Comparison of Failure Modes of Piping Systems With Wall Thinning Subjected to In-Plane, Out-of-Plane, and Mixed Mode Bending Under Seismic Load: An Experimental Approach

2010 · Izumi Nakamura, Akihito Otani, et al. · Journal of Pressure Vessel Technology · 21

Seismic Qualification of Piping Systems by Detailed Inelastic Response Analysis: Part 4 — Second Round Benchmark Analyses With Stainless Steel Piping Component Test

2017 · Tomoyoshi Watakabe, Izumi Nakamura, et al. · ASME Pressure Vessels and Piping Conference (PVP) · 17

Seismic Qualification of Piping System by Detailed Inelastic Response Analysis: Part 2 — A Guideline for Piping Seismic Inelastic Response Analysis

2017 · Akihito Otani, Tadahiro Shibutani, et al. · ASME Pressure Vessels and Piping Conference (PVP) · 15

Low-Cycle Fatigue Reliability Evaluation for Lead-Free Solders in Vehicle Electronics Devices

2007 · Qiang Yu, Tadahiro Shibutani, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 15

Structural Optimization Using the Design of Experiments and Mathematical Programming.

1996 · Takayoshi KASHIWAMURA, Masaki SHIRATORI, et al. · TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A · 15

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Problems of Joints in Packaging of Electronic Devices.

1994 · Masaki Shiratori · TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A · 15

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The Assessment of Influence of the Design Factors on the Reliability of BGA Solder Joints

2005 · Jae Chul Jin, Qiang Yu, et al. · Key engineering materials · 14

Failure Behavior of Piping Systems With Wall Thinning Under Seismic Loading

2004 · Izumi Nakamura, Akihito Otani, et al. · Journal of Pressure Vessel Technology · 14

A JSME Code Case on Piping Seismic Design Based on Inelastic Response Analysis and Strain-Based Fatigue Criteria

2019 · Masaki Morishita, Akihito Otani, et al. · Journal of Pressure Vessel Technology · 13

Seismic Qualification of Piping Systems by Detailed Inelastic Response Analysis: Part 3 — Variation in Elastic-Plastic Analysis Results on Carbon Steel Pipes From the Benchmark Analyses and the Parametric Analysis

2017 · Izumi Nakamura, Akihito Otani, et al. · ASME Pressure Vessels and Piping Conference (PVP) · 13

Seismic Qualification of Piping Systems by Detailed Inelastic Response Analysis: Part 1 — A Code Case for Piping Seismic Evaluation Based on Detailed Inelastic Response Analysis

2017 · Masaki Morishita, Akihito Otani, et al. · ASME Pressure Vessels and Piping Conference (PVP) · 13

Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis

2010 · Takashi Anzawa, Qiang Yu, et al. · Journal of Electronic Packaging · 13

Power cycle fatigue reliability evaluation for power device using coupled electrical-thermal-mechanical analysis

2008 · Takashi Anzawa, Qiang Yu, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 13

Failure Behavior of Elbows With Local Wall Thinning Under Cyclic Load

2004 · Izumi Nakamura, Akihito Otani, et al. · ASME Pressure Vessels and Piping Conference (PVP) · 13

Failure Behavior of Piping Systems With Wall Thinning Under Seismic Loading

2002 · Izumi Nakamura, Akihito Otani, et al. · ASME Pressure Vessels and Piping Conference (PVP) · 13

Works count: 392

Citation count: 1,170

H-index: 15

I10-index: 39