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Waad Tarman

Observed name: Wa’ad Tarman
ORCID: 0009-0005-9015-4672
Observed ORCID: 0009-0005-9015-4672
OpenAlex ID: A5114263018
Evaluating Shear Properties of Individual Solder Joints in Ball Grid Arrays: The Impact of Silver (Ag) and Bismuth (Bi) Content
2024 · Wa’ad Tarman, Ali Alahmer, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 5
Aging Effects on SAC305 Solder Joints: Correlating Intermetallic Compound Evolution, Hardness, and Drop-Shock Performance in ENIG and Immersion Tin Finishes
2026 · Saddam Daradkeh, Abdallah Alakayleh, et al. · Journal of Electronic Packaging · 1
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Microhardness Analysis of Reflowed Solder Joints: Effect of Paste Alloy and Paste Volume
2024 · Abdallah Alakayleh, Sufyan Tahat, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 1
Cross-Alloy Transfer Learning With Transferability Assessment for Mechanical Property Prediction of Lead-Free Solders
2026 · Qais Qasaimeh, Waad Tarman, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology
Works count: 4
Citation count: 7
H-index: 1
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