NMEMS Technology Research Organization

Homepage: nmems.or.jp

Alternate name: 技術研究組合NMEMS技術研究機構

ROR: 03dntmd83

OpenAlex ID: I4405255776

Void-Free Copper Filling of Through Silicon Via by Periodic Pulse Reverse Electrodeposition

2014 · Q. S. Zhu, A. Toda, et al. · Journal of The Electrochemical Society · 61

Surface activated bonding of Ti/Au and Ti/Pt/Au films after vacuum annealing for MEMS packaging

2018 · Takashi Matsumae, Yuichi Kurashima, et al. · Microelectronic Engineering · 60

Printed strain sensor array for application to structural health monitoring

2017 · Daniel Zymelka, Kazuyoshi Togashi, et al. · Smart Materials and Structures · 55

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Thin-film flexible sensor for omnidirectional strain measurements

2017 · Daniel Zymelka, Takahiro Yamashita, et al. · Sensors and Actuators A Physical · 44

Printed strain sensor with temperature compensation and its evaluation with an example of applications in structural health monitoring

2017 · Daniel Zymelka, Takahiro Yamashita, et al. · Japanese Journal of Applied Physics · 35

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Manufacturing process for piezoelectric strain sensor sheet involving transfer printing methods

2015 · Takahiro Yamashita, Hironao Okada, et al. · Japanese Journal of Applied Physics · 31

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Toward the World Smallest Wireless Sensor Nodes With Ultralow Power Consumption

2014 · Jian Lu, Hironao Okada, et al. · IEEE Sensors Journal · 30

Carbon-based printed strain sensor array for remote and automated structural health monitoring

2020 · Daniel Zymelka, Kazuyoshi Togashi, et al. · Smart Materials and Structures · 26

Fabrication and testing of polymer cantilevers for VOC sensors

2013 · N. Shiraishi, T. Ikehara, et al. · Sensors and Actuators A Physical · 26

Concentric Array of Printed Strain Sensors for Structural Health Monitoring

2020 · Daniel Zymelka, Kazuyoshi Togashi, et al. · Sensors · 24

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Efficient damage inspection of deteriorated RC bridge deck with rain-induced elastic wave

2018 · Hidefumi Takamine, Kazuo Watabe, et al. · Construction and Building Materials · 23

Novel TSV process technologies for 2.5D/3D packaging

2014 · Y. Morikawa, T. Murayama, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 23

Plastic-scale-model assembly of ultrathin film MEMS piezoresistive strain sensor with conventional vacuum-suction chip mounter

2019 · Seiichi Takamatsu, Shintaro Goto, et al. · Scientific Reports · 21

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Development of Flexible Piezoelectric Strain Sensor Array

2018 · TAKAHIRO YAMASHITA, SEIICHI TAKAMATSU, et al. · Electrical Engineering in Japan · 18

Carbon dioxide gas sensor with ionic gel

2013 · K. Ishizu, Y. Takei, et al. · International Conference on Solid-State Sensors, Actuators and Microsystems · 18

Surface activated bonding of Au/Cr, Au/Ta and Au/Pt/Ti films after degas annealing for Si/sapphire gas cell

2019 · Takashi Matsumae, Yuichi Kurashima, et al. · Microelectronic Engineering · 15

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Low power wireless human detector utilizing thermopile infrared array sensor

2014 · Junichi Tanaka, Hiroshi Imamoto, et al. · Proceedings of IEEE Sensors/Proceedings of IEEE Sensors ... · 15

A piezoelectric flow sensor for use as a wake-up switch for a wireless sensor network node

2013 · Yutaka Tomimatsu, Hidetoshi Takahashi, et al. · Mechatronics · 14

Elastic Wave Measurement Using a MEMS AE Sensor

2017 · Takahiro Omori, Takashi Usui, et al. · Applied Sciences · 13

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Development of 300 mm TSV interposer with redistribution layers on both sides using MEMS processes

2013 · Seiichi Yoshimi, Koji Fujimoto, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 13

Towards the world smallest wireless sensor nodes with low power consumption for ‘Green’ sensor networks

2013 · J. Lu, H. Okada, et al. · Proceedings of IEEE Sensors/Proceedings of IEEE Sensors ... · 12

Printed strain sensors for early damage detection in engineering structures

2018 · Daniel Zymelka, Takahiro Yamashita, et al. · Japanese Journal of Applied Physics · 11

Development of PMMA-based gas sensor and its evaluation using a VOC dilution flow system

2014 · N. Shiraishi, M. Kimura, et al. · Microelectronic Engineering · 11

Thin film based flexible current clamp sensor for green wireless sensor networks

2014 · Takahiro Yamashita, Yi Zhang, et al. · Proceedings of IEEE Sensors/Proceedings of IEEE Sensors ... · 8

Flexible current clamp sensor using screen-printed coil

2014 · Takahiro Yamashita, Yi Zhang, et al. · Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS · 8

Works count: 60

Citation count: 1,877