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Advanced Micro Devices (Singapore)
Homepage:
amd.com
Alternate names:
AMD Singapore,
Advanced Micro Devices (Singapore) Pte Ltd
Parent institution:
Advanced Micro Devices (United States)
ROR:
04jt1bz85
OpenAlex ID:
I4405256821
Analysis of thermoelectric cooler performance for high power electronic packages
2009
·
H.Y. Zhang
, Y.C. Mui
, et al.
·
Applied Thermal Engineering
·
195
Two-step synthesis of nanostructured tungsten carbide-cobalt powders
2001
·
L Fu
, L.H Cao
, et al.
·
Scripta Materialia
·
118
A general approach in evaluating and optimizing thermoelectric coolers
2010
·
H.Y. Zhang
·
International Journal of Refrigeration
·
116
Cell-aware Production test results from a 32-nm notebook processor
2012
·
F. Hapke
, M. Reese
, et al.
·
IEEE International Test Conference (ITC)
·
69
Efficient and broadband polarization rotator using horizontal slot waveguide for silicon photonics
2012
·
Huijuan Zhang
, Suchandrima Das
, et al.
·
Applied Physics Letters
·
63
Solder joint reliability of plastic ball grid array packages
1999
·
Chong Hua Zhong
, Sung Yi
·
Soldering and Surface Mount Technology
·
61
A review of laser induced techniques for microelectronic failure analysis
2004
·
J.C.H. Phang
, D.S.H. Chan
, et al.
·
IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
·
53
Customizing MRI‐Compatible Multifunctional Neural Interfaces through Fiber Drawing
2021
·
Marc‐Joseph Antonini
, Atharva Sahasrabudhe
, et al.
·
Advanced Functional Materials
·
49
PDF
TCAD-Enabled Machine Learning Defect Prediction to Accelerate Advanced Semiconductor Device Failure Analysis
2019
·
Chea-Wei Teo
, Kain Lu Low
, et al.
·
International Conference on Simulation of Semiconductor Processes and Devices
·
48
A Digitally Assisted, Signal Folding Neural Recording Amplifier
2014
·
Yi Chen
, Arindam Basu
, et al.
·
IEEE Transactions on Biomedical Circuits and Systems
·
44
Non-Fickian moisture properties characterisation and diffusion modeling for electronic packages
2003
·
E.H. Wong
, K.C. Chan
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
40
Fault isolation in semiconductor product, process, physical and package failure analysis: Importance and overview
2011
·
Jiann Min Chin
, Vinod Narang
, et al.
·
Microelectronics Reliability
·
34
ApproxTrain: Fast Simulation of Approximate Multipliers for DNN Training and Inference
2023
·
Jing Gong
, Hassaan Saadat
, et al.
·
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
·
31
PDF
High-res 3D X-ray microscopy for non-destructive failure analysis of chip-to-chip micro-bump interconnects in stacked die packages
2017
·
Syahirah Md Zulkifli
, Bemice Zee
, et al.
·
IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
·
29
LAN-based control for load shedding
2001
·
Bin Qiu
, Yilu Liu
, et al.
·
IEEE Computer Applications in Power
·
28
Miniature auto‐perfusion bioreactor system with spiral microfluidic cell retention device
2021
·
Lu Yin
, Wen Y. Au
, et al.
·
Biotechnology and Bioengineering
·
26
A O.96pJ/b 7 × 50Gb/s-per-Fiber WDM Receiver with Stacked 7nm CMOS and 45nm Silicon Photonic Dies
2023
·
Mayank Raj
, Chuan Xie
, et al.
·
Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference
·
25
Reliability Study on Copper Pillar Bumping with Lead Free Solder
2007
·
Jinhua Yu
, Ashok Anand
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
25
Development of a lead free chip scale package for wireless applications
2002
·
V. Kripesh
, Poi-Siong Teo
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
23
Comparison of experimental, analytical and simulation methods to estimate substrate material properties for warpage reliability analysis
2018
·
Cheryl Selvanayagam
, Rathin Mandal
, et al.
·
Microelectronics Reliability
·
22
Missing solder ball failure mechanisms in plastic ball grid array packages
2002
·
C.H. Zhong
, S. Yi
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
22
Test Data Volume Comparison: Monolithic vs. Modular SoC Testing
2009
·
Ozgur Sinanoglu
, Erik Jan Marinissen
, et al.
·
IEEE Design & Test of Computers
·
21
A Novel Approach for the Patterning and High-Volume Production of Sub-40-nm Gates
2005
·
K. Romero
, R. Stephan
, et al.
·
IEEE Transactions on Semiconductor Manufacturing
·
20
Comparative analysis of using MW-mile methods in transmission cost allocation for the Malaysia power system
2005
·
M.Z. Meah
, A. Mohamed
, et al.
·
National Power Engineering Conference (PECon)
·
20
Neural Network Assisted Speed Up of High Fidelity Warpage Simulations towards Design for Reliability in Ultra-Thin Packages
2019
·
Cheryl Selvanayagam
, Rathin Mandal
, et al.
·
IEEE CPMT Symposium Japan (ICSJ)
·
19
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Works count:
254
Citation count:
4,194
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