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Tazmo Co., Ltd. (Japan)
Homepage:
tazmo.co.jp
Alternate names:
Tazmo Co., Ltd.,
タツモ株式会社
ROR:
01yj45475
OpenAlex ID:
I4405264444
Direct Transfer Bonding Technology Enabling 50-nm Scale Accuracy for Die-to-Wafer 3D/Heterogeneous Integration
2025
·
Ichiro Sano
, Masanori Yamagishi
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
10
High-Performance and High-CRI OLEDs for Lighting and Their Fabrication Processes
2010
·
Takuya Komoda
, Toshihiro Iwakuma
, et al.
·
Advances in science and technology
·
8
Material Optimization of Permanent and Temporary Adhesives for Wafer-level Three-dimensional Integration
2020
·
Naoko Araki
, Shinji Maetani
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
7
Subcapsular liver hematoma complicating HELLP syndrome: A case report and review of management strategies
2023
·
Agnès Villart
, Pauline Burban
, et al.
·
Case Reports in Women s Health
·
6
A Novel Direct Transfer Bonding Process with Particle Less Tapes for Die to Wafer Integration
2024
·
Tomoka Kirihata
, Masanori Yamagishi
, et al.
·
IEEE International D Systems Integration Conference
·
4
High Precision Direct Transfer Bonding for Submicron Die-to-Wafer in 3D/Heterogeneous Integration
2024
·
Ichiro Sano
, Katsuya Yamada
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
4
A New Carrier Tape for Direct Transfer Bonding (DTB) Process with Ultra-Thin Chips
2025
·
Tomoka Kirihata
, Masanori Yamagishi
, et al.
·
European Microelectronics and Packaging Conference
·
2
Microfluidic device for differentiation induction of iPS cells derived embryoid bodies with local chemical stimulation
2023
·
Naoto Kusunoki
, Shuhei Konagaya
, et al.
·
Electronics and Communications in Japan
·
2
PDF
Direct Transfer Bonding of Ultra-thin Warped Chips for Advanced Heterogeneous 3DIC Integration with Fine-pitch Direct/Hybrid Bonding
2026
·
Ichiro Sano
, Jun Kaneyasu
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
1
Laser-Assisted Bonding Technology for Room-Temperature Wafer-Level Hermetic Packaging of MEMS
2025
·
Shumpei Ii
, Yoshinori Ikagawa
, et al.
·
International Conference on Solid-State Sensors, Actuators and Microsystems
Microfluidic Device for Differentiation Induction of iPS Cells-derived Embryoid Bodies with Local Chemical Stimulation
2022
·
Naoto Kusunoki
, Shuhei Konagaya
, et al.
·
IEEJ Transactions on Sensors and Micromachines
My 40 Years Full of ^|^ldquo;Kindness^|^rdquo;, ^|^ldquo;Fun^|^rdquo; and ^|^ldquo;Excitement^|^rdquo;, and Future
2013
·
Shuuji UEDA
·
Journal of the Japan Society for Precision Engineering
PDF
A trial to quantify and classify process nonuniformity into baking and development
2004
·
Hideo Kobayashi
, Tomohiro Shirane
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
Possibility of a spin cup method
1998
·
Terumasa Tokimitsu
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
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Works count:
14
Citation count:
79
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