Shinko (Japan)

Alternate names: Shinko Ind. Ltd., シンコー

ROR: 03m9qx522

OpenAlex ID: I4405284468

Development of new 2.5D package with novel integrated organic interposer substrate with ultra-fine wiring and high density bumps

2014 · Kiyoshi Oi, Satoshi Otake, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 150

Analyses on Blast Furnace Raceway Formation by Micro Wave Reflection Gunned through Tuyere

2005 · Yoshiyuki MATSUI, Yasuhiro YAMAGUCHI, et al. · ISIJ International · 32

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Continuous mass measurement in checkweighers and conveyor belt scales

2003 · T. Yamazaki, Y. Sakurai, et al. · SICE Annual Conference (SICE) · 31

POL-kw Modules for High Power Applications

2017 · Liang Yin, Kaustubh Nagarkar, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 23

Electro-migration behavior in low temperature flip chip bonding

2012 · Kei Murayama, Mitsutoshi Higashi, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 14

Study of electro-migration resistivity of micro bump using SnBi solder

2014 · Kei Murayama, Mitsuhiro Aizawa, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 11

Analyses on Dynamic Solid Flow in Blast Furnace Lower Part by Deadman Shape and Raceway Depth Measurement

2005 · Yoshiyuki MATSUI, Mutsumi TANAKA, et al. · ISIJ International · 11

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Metallization Technologies on a Smooth Resin Surface for the Next Generation of Flip Chip Packaging

2010 · Michio Horiuchi, Tomoo Yamasaki, et al. · Transactions of The Japan Institute of Electronics Packaging · 10

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Stabilization of Tapping Hole Length by Controlling Blast Furnace Raceway Depth

2005 · Yoshiyuki MATSUI, Rikizo TADAI, et al. · ISIJ International · 5

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Driving at Resonance Point of Elliptical Vibration Machine Using Velocity Feedback

2004 · Yasushi MURAGISHI, Yutaka KURITA, et al. · TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series C · 5

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New Application Technology for Ozone: Use of Highly Concentrated Ozonated Water

2001 · Yoshiyuki NISHIMURA, Takahumi KANAYA, et al. · Japan Journal of Food Engineering · 5

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Effects of Ca Addition on Solidification Structure of Cu-Sn-Zn Bronze Castings

2007 · Kazuhiro Matsugi, Takayuki Hino, et al. · MATERIALS TRANSACTIONS · 4

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Continuous Mass Measurement on Conveyor Belt

2006 · Yuki Tomobe, Ryosuke Tasaki, et al. · IEEJ Transactions on Electronics Information and Systems · 4

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Darlington Power Switches using Si-SJBJT and SiC-MOSFET

2024 · Shoma Wakui, Koji Yano · IEEJ Journal of Industry Applications · 3

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Flow and Heat Transfer Characteristics of Liquid–Solid Circulating Fluidized Beds

2011 · Kenichi Hashizume, Shinichi Morita, et al. · Heat Transfer Engineering · 3

Gsd-05 Influence of Design Parameters on Strength and Driving Performance of Involute-cycloid Composite Tooth Profile Gears(gear Strength and Durability, Including Gear Materials and Heat Treatment Techniques)

2009 · Natsuhiko SEYAMA, Kazuteru NAGAMURA, et al. · The Proceedings of the JSME international conference on motion and power transmissions · 3

絶縁信頼性関係（マイグレーション主体）プリント配線板の絶縁信頼性について

2008 · Kazuhiro NAKAMURA · Journal of The Japan Institute of Electronics Packaging · 3

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Development of High Strength Steel Strand for Prestressed Concrete

2007 · Toshio MAEHATA, Motohiro NAKANO, et al. · Journal of the Society of Materials Science Japan · 3

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マイクロデバイス実装と表面技術Ｉｉ３次元実装技術と微細配線めっき技術の応用

2001 · Shin-ichi WAKABAYASHI, Michio HORIUCHI, et al. · Journal of The Surface Finishing Society of Japan · 3

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Stereoscopic liquid crystal display II (practical application)

1994 · Yoko Nishida, Tomohiko Hattori, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3

Effect of single-boiling crystallization of high-yielding sugarcane KY01-2044 on sugar and molasses production

2023 · Satoshi Ohara, Yosuke Hamada, et al. · Food Science and Technology Research · 2

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Development of Embedded Device Package, MCeP® (Molded Core embedded Package)

2017 · Kouichi Tanaka, Yoshihiro Machida, et al. · Journal of The Japan Institute of Electronics Packaging · 2

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The Characteristic Evaluations of Nickel/Multi-Wall Carbon Nano Tubes Composite Electroplating

2005 · Toyoaki SAKAI, Masao NAKAZAWA, et al. · Journal of The Japan Institute of Electronics Packaging · 2

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Baking Effect for Outgassing Rate of Titanium Alloy

2004 · Takeshi MURANAKA, Hiroki KURISU, et al. · Shinku · 2

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Technical trends of LSI packaging: recent advances in CSPs and high density substrates

2003 · S. Wakabayashi, M. Shimizu · Symposium on VLSI Circuits · 2

Works count: 58

Citation count: 1,628