Work

Study of electro-migration resistivity of micro bump using SnBi solder

Year: 2014

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc.2014.6897437

Authors: Kei Murayama, Mitsuhiro Aizawa, Mitsutoshi Higashi

Institutions: Shinko Electric Industries (Japan), Shinko Electric Co., Ltd. (Japan), Shinko (Japan), Shinko (Japan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2061967213

FWCI: 2.006

Cites: 16

Cited by: 11

Related to: 10