Source

International 3D Systems Integration Conference (3DIC)

Source type: conference

Alternate names: 2014 International 3D Systems Integration Conference (3DIC), 2015 International 3D Systems Integration Conference (3DIC), 2019 International 3D Systems Integration Conference (3DIC)

Fully OA: No

DOAJ: No

OpenAlex ID: S7407087437

Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectrics

2015 · Soon-Wook Kim, Lan Peng, et al. · International 3D Systems Integration Conference (3DIC) · 42

Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding

2014 · Y. Beilliard, T. Signamarcheix, et al. · International 3D Systems Integration Conference (3DIC) · 41

3D integration: Applications and market trends

2015 · Rozalia Beica · International 3D Systems Integration Conference (3DIC) · 38

High productivity thermal compression bonding for 3D-IC

2015 · Noboru Asahi, Yoshinori Miyamoto, et al. · International 3D Systems Integration Conference (3DIC) · 32

Active Si interposer for 3D IC integrations

2015 · Joungho Kim · International 3D Systems Integration Conference (3DIC) · 27

Heterogeneous and 3D Integration at DARPA

2019 · Timothy M. Hancock, Jeffrey C. Demmin · International 3D Systems Integration Conference (3DIC) · 23

3D Integration Technologies for the Stacked CMOS Image Sensors

2019 · Y. Kagawa, H. Iwamoto · International 3D Systems Integration Conference (3DIC) · 23

Thermal performance of 3D ICs: Analysis and alternatives

2014 · Cristiano Santos, Pascal Vivet, et al. · International 3D Systems Integration Conference (3DIC) · 23

Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module

2015 · Hyunsuk Lee, Kyungjun Cho, et al. · International 3D Systems Integration Conference (3DIC) · 20

Design Enablement of Fine Pitch Face-to-Face 3D System Integration using Die-by-Die Place & Route

2019 · Giuliano Sisto, Peter Debacker, et al. · International 3D Systems Integration Conference (3DIC) · 18

Protective Layer for Collective Die to Wafer Hybrid Bonding

2019 · Fumihiro Inoue, Julien Bertheau, et al. · International 3D Systems Integration Conference (3DIC) · 18

Low Temperature Cu to Cu Direct Bonding below 150 °C with Au Passivation Layer

2019 · Demin Liu, Po-Chih Chen, et al. · International 3D Systems Integration Conference (3DIC) · 18

3D advanced integration technology for heterogeneous systems

2015 · Pascal Vivet, Christian Bernard, et al. · International 3D Systems Integration Conference (3DIC) · 17

Path to 3D heterogeneous integration

2015 · Daniel S. Green, Carl L. Dohrman, et al. · International 3D Systems Integration Conference (3DIC) · 15

Thermal challenges for heterogeneous 3D ICs and opportunities for air gap thermal isolation

2014 · Yang Zhang, Thomas E. Sarvey, et al. · International 3D Systems Integration Conference (3DIC) · 15

Analysis of thermal stress distribution for TSV with novel structure

2014 · Wei Feng, Naoya Watanabe, et al. · International 3D Systems Integration Conference (3DIC) · 15

TSV noise coupling in 3D IC using guard ring

2015 · R Ranga Reddy, Sugandh Tanna, et al. · International 3D Systems Integration Conference (3DIC) · 13

3D-IC technologies and 3D FPGA

2015 · Xin Wu · International 3D Systems Integration Conference (3DIC) · 13

Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation

2015 · Daniel H. Jung, Heegon Kim, et al. · International 3D Systems Integration Conference (3DIC) · 11

Enabling automatic system design optimization through Assembly Design Kits

2015 · Andy Heinig, Robert Fischbach · International 3D Systems Integration Conference (3DIC) · 11

Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges

2014 · Joeri De Vos, Vladimir Cherman, et al. · International 3D Systems Integration Conference (3DIC) · 11

Using TSVs for thermal mitigation in 3D circuits: Wish and truth

2014 · Cristiano Santos, Papa Momar Souare, et al. · International 3D Systems Integration Conference (3DIC) · 11

Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development

2019 · E. Bourjot, P. Stewart, et al. · International 3D Systems Integration Conference (3DIC) · 10

A 6.9 μm Pixel-Pitch 3D Stacked Global Shutter CMOS Image Sensor with 3M Cu-Cu connections

2019 · Tsukasa Miura, Masaki Sakakibara, et al. · International 3D Systems Integration Conference (3DIC) · 10

Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields

2019 · A. Jouve, L. Sanchez, et al. · International 3D Systems Integration Conference (3DIC) · 10

Works count: 241

Citation count: 1,014

H-index: 15

I10-index: 27

2yr mean citedness: 1.429