Advanced thermal ground plane for microelectronics
Year: 2011
Type: conference-paper
Authors: Jiacai Oh, Kingho Li, Soon‐Eng Ong, Kokfah Choo
Institutions: Nanyang Technological University, Temasek Laboratories
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W118022845