Work

Comparative study of the effects of coalesced and distributed solder die attach voids on thermal resistance of packaged semiconductor device

Year: 2011

Type: conference-paper

Source: Greenwich Academic Literature Archive (University of Greenwich)

Authors: Kenny C. Otiaba, Raj Bhatti, N.N. Ekere, Mathias Ekpu, J. Adeyemi

Institution: University of Greenwich

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1719341013

FWCI: 0.424

Cites:

Cited by: 5

Related to: 10