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Characterization and Optimization of Single Wafer Processing Equipment with Advanced Aqueous Formulations to Achieve Lower Cost of Ownership for Advanced Cu Interconnect Cleaning Processes

Year: 2008

Type: conference-paper

Source: ASMC proceedings

DOI: 10.1109/asmc.2008.4529043

Authors: Simon Kirk, Chiu Tse, Eric Wang, Cooper Wu, Sang Min Wong, Sally Ann Henry, Leo Archer, Jason West, Erkan Cakmak

Institution: DuPont (United States)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

SDGs: Responsible consumption and production, Clean water and sanitation

Open Access status: closed

OpenAlex ID: W1971052195

FWCI:

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