Thermo-Mechanical Response of Thru-Silicon Vias Under Local Thermal Transients Using Experimentally Validated Finite Element Models
Year: 2011
Type: article
Source: Journal of Electronic Packaging
DOI: 10.1115/1.4004656
Institutions: IBM (United States), University of California San Diego
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2047775625