Improvement of thermal stability of via resistance in dual damascene copper interconnection
Year: 2002
Type: conference-paper
Authors: T. Oshima, T. Tamaru, K. Ohmori, H. Aoki, H. Ashihara, T. Saito, H. Yamaguchi, M. Miyauchi, K. Torii, J. Murata, A. Satoh, H. Miyazaki, K. Hinode
Institutions: Hitachi (Japan), Hitachi Solutions Technology, Ltd. (Japan)
Language: English
Field: Materials Science
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2535484322