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Wafer-Level High Density Multifunctional Integration (HDMI) for Low-Cost Micro/Nano/Electro-Opto/Bio Heterogeneous Systems

Year: 2003

Type: article

Source: TechConnect Briefs

Authors: T.S. Cale, James Castracane, Eric Eisenbraun, R.J. Gutmann, Kaloyeros A.E, JQ Lu, J. J. McMahon, P. D. Persans

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2900226354

FWCI: 0.335

Cites:

Cited by: 1

Related to: 10