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J. Jay McMahon

Observed names: J. J. MCMAHON, J. J. McMahon, J.J. McMahon, J. J. McMahon, Jay McMahon
Observed institutions: Argonne National Laboratory, General Electric (United States), Fordham University, Rensselaer Polytechnic Institute, GE Global Research (United States), Case Western Reserve University
OpenAlex ID: A5111686933
Viscoplasticity based on overstress with a differential growth law for the equilibrium stress
1986 · E. Krempl, J.J. McMahon, et al. · Mechanics of Materials · 147
Adhesive Wafer Bonding Using Partially Cured Benzocyclobutene for Three-Dimensional Integration
2006 · F. Niklaus, R. J. Kumar, et al. · Journal of The Electrochemical Society · 80
Passive microfluidic device for submillisecond mixing
2009 · Zonghuan Lu, Jay McMahon, et al. · Sensors and Actuators B Chemical · 56
Wafer bonding of damascene-patterned metal/adhesive redistribution layers for via-first three-dimensional (3D) interconnect
2005 · J.J. McMahon, J.-Q. Lu, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 54
Evaluation procedures for wafer bonding and thinning of interconnect test structures for 3D ICs
2004 · J.-Q. Lu, A. Jindal, et al. · IEEE International Interconnect Technology Conference (IITC) · 40
Back-end compatibility of bonding and thinning processes for a wafer-level 3D interconnect technology platform
2004 · S. Pozder, J.-Q. Lu, et al. · IEEE International Interconnect Technology Conference (IITC) · 32
Bonding interfaces in wafer-level metal/adhesive bonded 3D integration
2008 · J. J. McMahon, E. Chan, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 29
3D Integration Using Adhesive, Metal, and Metal/Adhesive as Wafer Bonding Interfaces
2008 · Jian-Qiang Lu, J. Jay McMahon, et al. · MRS Proceedings · 20
High-temperature “in-situ” surface Raman spectroelectrochemistry in aqueous solutions
1986 · C.A. Melendres, J.J. McMahon, et al. · Journal of Electroanalytical Chemistry · 19
Thermomechanical Properties of Parylene X, A Room‐Temperature Chemical Vapor Depositable Crosslinkable Polymer
2007 · J. J. Senkevich, B. W. Woods, et al. · Chemical Vapor Deposition · 17
Fine Keyed Alignment and Bonding for Wafer-Level 3D ICs
2006 · Sang Hwui Lee, Frank Niklaus, et al. · MRS Proceedings · 17
Dielectric GlueWafer Bonding For 3D ICs
2003 · Y. Kwon, A. Jinda, et al. · MRS Proceedings · 17
In Situ Laser Raman Spectroelectrochemical Study of the Corrosion of Lead in Dilute Na2 SO 4 Solution at High Temperature
1988 · J. J. McMahon, W. Ruther, et al. · Journal of The Electrochemical Society · 16
Wafer-Level 3D Integration Technology Platforms for ICs and MEMS
2005 · Frank Niklaus, J. J. McMahon, et al. · 15
CMP Compatibility of Partially Cured Benzocyclobutene (BCB) for a Via-First 3D IC Process
2005 · J. J. McMahon, F. Niklaus, et al. · MRS Proceedings · 13
Surface Raman scattering and electrochemistry of iron protoporphyrin IX at a polycrystalline silver electrode
1986 · J. J. McMahon, S. Baer, et al. · The Journal of Physical Chemistry · 13
Via-First Inter-Wafer Vertical Interconnects utilizing Wafer-Bonding of Damascene-Patterned Metal/Adhesive Redistribution Layers
2006 · Jian-Qiang Lü, J. J. McMahon, et al. · 12
Effects of Bonding Process Parameters on Wafer-to-Wafer Alignment Accuracy in Benzocyclobutene (BCB) Dielectric Wafer Bonding
2005 · F. Niklaus, R.J. Kumar, et al. · MRS Proceedings · 11
Deposition and Characterization of In-Situ Boron Doped Polycrystalline Silicon Films for Microelectromechanical Systems Applications
1999 · J. J. McMahon, J. J. McMahon, et al. · MRS Proceedings · 10
Hybrid Metal/Polymer Wafer Bonding Platform
2012 · Jian‐Qiang Lu, J. Jay McMahon, et al. · 8
Damascene-Patterned Metal-Adhesive (Cu-BCB) Redistribution Layers
2006 · Ronald J. Gutmann, J. Jay McMahon, et al. · MRS Proceedings · 8
Evaluation of Thin Dielectric-Glue Wafer-Bonding for Three Dimensional Integrated Circuit-Applications
2004 · Y. Kwon, J. Yu, et al. · MRS Proceedings · 7
Wafer Thinning for Monolithic 3D Integration
2003 · A. Jindal, J.Q. Lu, et al. · MRS Proceedings · 7
Wafer-Level Via-First 3D Integration With Hybrid-Bonding Of Cu/BCB Redistribution Layers
2005 · R.J. Gutmann, J.J. McMahon, et al. · Wafer-Level Packaging Symposium · 6
Viscoplasticity based on overstress with a differential growth law for the equilibrium stress
1985 · E. Krempl, J. J. McMahon, et al. · NASA STI Repository (National Aeronautics and Space Administration) · 6
Works count: 42
Citation count: 691
H-index: 14
I10-index: 20
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