Wafer-Level Via-First 3D Integration With Hybrid-Bonding Of Cu/BCB Redistribution Layers
Year: 2005
Type: conference-paper
Source: Wafer-Level Packaging Symposium
Authors: R.J. Gutmann, J.J. McMahon, S. Rao, F. Niklaus, J.-Q. Lu
Institution: Rensselaer Polytechnic Institute
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W220186610